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Bonding Issues For Multi-Chip Packages


The rising cost and complexity of developing chips at the most advanced nodes is forcing many chipmakers to begin breaking up that chip into multiple parts, not all of which require leading edge nodes. The challenge is how to put those disaggregated pieces back together. When a complex system is integrated monolithically — on a single piece of silicon — the final product is a compromise ... » read more

Planning For Panel-Level Fan-out


Several companies are developing or ramping up panel-level fan-out packaging as a way to reduce the cost of advanced packaging. Wafer-level fan-out is one of several advanced packaging types where a package can incorporate dies, MEMS and passives in an IC package. This approach has been in production for years, and is produced in a round wafer format in 200mm or 300mm wafer sizes. Fan-out... » read more

Five Trends In IC Packaging


At one time, chip packaging was an afterthought. Chipmakers were more worried about IC design. Packaging was considered a mere commodity, which was simply used to house the design. More recently, though, chip packaging has become a hot topic. The IC design is still important, but packaging is a key part of the solution. In fact, the industry can go down two paths. The traditional way is t... » read more