Inside X-ray Metrology

By Mark LaPedus - 19 Nov, 2015 - Comments: 0

Chipmakers are ramping up a new class of chip architectures, such as 3D NAND and finFETs. Measuring and characterizing the tiny structures in these technologies is a major challenge. It will not only take the traditional metrology tools, but also various X-ray techniques. To get a handle on X-ray metrology, Semiconductor Engineering recently discussed the trends with the following experts: ... » read more

Inside A 450mm Metrology Consortium

By Mark LaPedus - 20 Jun, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss 450mm metrology challenges with Menachem Shoval, a former manufacturing executive at Intel and chairman of the Metro450 consortium. The Israeli-based consortium is developing metrology technology for the next-generation, 450mm wafer size. The group consists of Intel, Applied Materials, Jordan Valley, Nanomotion, Nov... » read more

The Bumpy Road To 450mm

By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus After its formation nearly 20 months ago, a 450mm consortium has reached its latest milestone by recently completing a cleanroom and installing the first 450mm demonstration tools in the facility. The so-called Global 450 Consortium (G450C) also has set a goal to bring 450mm fabs into high-volume manufacturing at the 10nm or 7nm nodes by 2018. That gives the industry a littl... » read more

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tag: Jordan Valley

Inside X-ray Metrology

Inside A 450mm Metrology Consortium

The Bumpy Road To 450mm

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