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Week In Review: Manufacturing, Test


Packaging and test Advantest and PDF Solutions have launched their first jointly developed offering since forming a partnership in 2020. The new product is called the Advantest Cloud Solutions Dynamic Parametric Test (ACS DPT) solution. It integrates PDF Solutions’ Exensio portfolio of data analytics with Advantest’s V93000 Parametric Test System. The ACS DPT solution is designed to op... » read more

Manufacturing Bits: Aug. 18


Quantum Internet The U.S. Department of Energy (DOE) recently unveiled a strategy to develop a quantum Internet in the United States. DOE’s 17 National Laboratories will serve as the backbone of the quantum Internet, which will rely on the laws of quantum mechanics to control and transmit information over a network. Currently in its initial stages of development, the quantum Internet coul... » read more

Week In Review: Manufacturing, Test


Fab tool shipping costs The coronavirus is impacting semiconductor equipment companies. Many have withdrawn their previous forecasts. “It has also led to a rise in shipping costs,” said Krish Sankar, an analyst with Cowen, in a research note. Most semiconductor equipment and components are shipped via air, according to Sankar. The exception is flat-panel display equipment and other sys... » read more

Improving EUV Process Efficiency


The semiconductor industry is rethinking the manufacturing flow for extreme ultraviolet (EUV) lithography in an effort to improve the overall process and reduce waste in the fab. Vendors currently are developing new and potentially breakthrough fab materials and equipment. Those technologies are still in R&D and have yet to be proven. But if they work as planned, they could boost the flo... » read more

Week In Review: Manufacturing, Test


Fab tools The United States is mulling over new trade export restrictions for U.S. fab equipment to China, according to a report from The Wall Street Journal. “Recent press reports suggest the U.S. Department of Commerce is exploring additional measures to limit Huawei's access to U.S. semiconductor capital equipment (SPE) by requiring chip manufacturing plants globally to procure license... » read more

Week In Review: Manufacturing, Test


AI chip boom or bust? The semiconductor industry is the most bullish about adopting artificial intelligence (AI), according to a new report from Accenture. Some 77% of semiconductor executives surveyed said they have adopted AI within their businesses or are piloting the technology. In addition, 63% of semiconductor executives expect that AI will have the greatest impact on their business over... » read more

Manufacturing Bits: July 10


Semicon West It’s Semicon West time again. Here’s the first wave of announcements at the event: Applied Materials has unveiled a pair of tools aimed at accelerating the industry adoption for new memories. First, Applied rolled out the Endura Clover MRAM PVD system. The system is an integrated platform for MRAM devices. Second, the company introduced the Endura Impulse PVD platform for P... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Cypress Semiconductor has received regulatory antitrust approval for the closing of its previously-announced joint venture with SK Hynix. The new joint venture, SkyHigh Memory, will provide single-level cell (SLC) NAND memory solutions. Cree has announced the execution of a definitive agreement to sell its Lighting Products business unit (Cree Lighting), which includes t... » read more

EUV’s New Problem Areas


Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

The Week In Review: Manufacturing


Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

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