tag: JSR

EUV’s New Problem Areas
By Mark LaPedus - 19 Mar, 2018 - Comments: 2

Extreme ultraviolet (EUV) lithography is moving closer to production, but problematic variations—also known as stochastic effects—are resurfacing and creating more challenges for the long-overdue technology. GlobalFoundries, Intel, Samsung and TSMC hope to insert [gettech id="31045" comment="EUV"] lithography into production at 7nm and/or 5nm. But as before, EUV consists of several compo... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 10 Nov, 2017 - Comments: 0

Packaging and test A*STAR’s Institute of Microelectronics (IME) has formed a fan-out wafer-level packaging consortium comprising of OSATs, materials vendors, equipment suppliers and others. The group is called the FOWLP Development Line Consortium. As part of the announcement, Singapore’s IME has established a development line to accelerate the development of fan-out. Located in IME’s... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Sep, 2017 - Comments: 0

Chipmakers Toshiba has changed its mind yet again about which group will buy its prized memory unit. On June 20, Toshiba chose a Japanese government-led consortium of INCJ/DBJ, Bain Capital and South Korea’s SK Hynix. Then, Toshiba changed its mind and selected a similar group with Western Digital (WDC), leaving SK Hynix on the outside looking in. This week, Toshiba signed a deal with a B... » read more

5 Takeaways From Semicon
By Mark LaPedus - 20 Jul, 2017 - Comments: 0

At the recent Semicon West trade show in San Francisco, there were a multitude of presentations on a number of subjects. The event, sponsored by SEMI, had presentations on the outlook for ICs, equipment and packaging. Clearly, though, the show is much smaller with fewer attendees, as compared to past years. Most of the big companies no longer have booths. Hardly any have press events or med... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 14 Jul, 2017 - Comments: 1

Market research SEMI has released its mid-year forecast at Semicon West. SEMI reported that worldwide sales of new semiconductor manufacturing equipment are projected to increase by 19.8% to a total of $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000. In 2018, 7.7% growth is expected, resulting in an... » read more

EUV Resists Move Forward
By Katherine Derbyshire - 23 Mar, 2016 - Comments: 0

Improvements in EUV exposure sources and exposure tools are shifting the industry’s focus to other components of the lithography process. As noted last year, one of the key areas is photoresists. But advanced photoresists face significant challenges, due to the need to balance sensitivity, etch selectivity, and resolution. This year’s SPIE Advanced Lithography conference featured promis... » read more

Ready For Nanoimprint?
By Michael Watts - 17 Mar, 2016 - Comments: 0

Nanoimprint has been discussed, debated, and hyped since the term was first introduced in 1996. Now, a full 20 years later, it is being taken much more seriously in light of increasing photomask costs and delays in bringing alternatives to market. Nanoimprint lithography is something like a room-temperature UV cure embossing process. The structures are patterned onto a template or mold using... » read more

Manufacturing Bits: Feb. 23
By Mark LaPedus - 23 Feb, 2016 - Comments: 1

EUV resist venture JSR and Imec have signed a deal to form a joint venture to develop resists for extreme ultraviolet (EUV) lithography. The new company, dubbed EUV Resist Manufacturing & Qualification Center NV, is incorporated with a majority of the total shares held by JSR Micro NV. As EUV technology advances, the IC industry is putting pressure on materials suppliers and other vendo... » read more

Fan-Out Packaging Gains Steam
By Mark LaPedus - 23 Nov, 2015 - Comments: 1

Fan-outs are creating a buzz and gaining steam in the market at a pace far beyond what anyone would have expected even at the start of the year. The approach, which has been around for several years, is a wafer-level packaging process that enables ultra-thin, high-density packages. So why the buzz? Apple is apparently moving to [getkc id="202" kc_name="fan-out"] packaging, according to an... » read more

Manufacturing Bits: Oct. 20
By Mark LaPedus - 20 Oct, 2015 - Comments: 0

Singapore opens R&D center The Agency for Science, Technology and Research (A*STAR) has officially opened its new R&D center in Singapore. The center, dubbed Fusionopolis Two, is a $450 million facility, according to Singapore’s A*STAR. It will provide the industry with co-location opportunities for R&D. Anchored at Fusionopolis Two are the following A*STAR research institutes: th... » read more

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