Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 01 Sep, 2023 - Comments: 0

The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Chips Can Boost Malware Immunity

By John Koon - 15 Jun, 2022 - Comments: 0

Security is becoming an increasingly important design element, fueled by increasingly sophisticated attacks, the growing use of technology in safety-critical applications, and the rising value of data nearly everywhere. Hackers can unlock automobiles, phones, and smart locks by exploiting system design soft spots. They even can hack some mobile phones through always-on circuits when they are... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 23 Dec, 2021 - Comments: 0

Chipmakers TSMC has introduced another version of its 4nm process technology. The process, called N4X, is tailored for high-performance computing products. Recently, TSMC introduced another 4nm process, called N4P, which is an enhanced version of its 5nm technology. N4X is also an enhanced version of its 5nm technology. N4X, however, offers a performance boost of up to 15% over TSMC’s N5 pro... » read more

Emerging Apps And Challenges For Packaging

By Mark LaPedus - 23 Nov, 2020 - Comments: 0

Advanced packaging is playing a bigger role and becoming a more viable option to develop new system-level chip designs, but it also presents chipmakers with a confusing array of options and sometimes a hefty price tag. Automotive, servers, smartphones and other systems have embraced advanced packaging in one form or another. For other applications, it's overkill, and a simpler commodity pack... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Juniper

Week In Review: Auto, Security, Pervasive Computing

Chips Can Boost Malware Immunity

Week In Review: Manufacturing, Test

Emerging Apps And Challenges For Packaging