The Week In Review: IoT

By Jeff Dorsch - 12 May, 2017 - Comments: 0

Conferences The Internet of Things World conference is on tap next week at the Santa Clara Convention Center in Silicon Valley. There will be more than 250 exhibitors on the show floor, with 11,000 attendees expected. More than 400 speakers will make presentations over three days, May 16-17-18. ON Semiconductor will have a number of IoT-related products to demonstrate at its booth, including i... » read more

The Week In Review: Design

By Jesse Allen - 07 Apr, 2017 - Comments: 0

Name Changes Arteris changed its name to ArterisIP. The company said the name change better reflects what the company does, which is provide IP for SoC communication on-die and between die. Mentor Graphics also modified its name, following last week's announcement that the acquisition by Siemens has been completed. The company is now officially called Mentor, A Siemens Business. It also ... » read more

Silicon Photonics Comes Into Focus

By Ed Sperling - 31 Oct, 2016 - Comments: 5

Silicon photonics is attracting growing attention and investment as a companion technology to copper wiring inside of data centers, raising new questions about what comes next and when. Light has always been the ultimate standard for speed. It requires less energy to move large quantities of data, generates less heat than electricity, and it can work equally well over long or short distances... » read more

Scare Of The Month: The Breach At Juniper

By Ernest Worthman - 07 Jan, 2016 - Comments: 0

Details are sketchy, but it was definitely a back door hack of Juniper. That almost always points in the direction of an inside job. So far, no one quite knows how exactly the hack was accomplished. But what scares me is that, supposedly, this code has been in the system for three years already. Drilling down a bit, it turns out there was more than one back door. One of them allowed ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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tag: Juniper Networks

The Week In Review: IoT

The Week In Review: Design

Silicon Photonics Comes Into Focus

Scare Of The Month: The Breach At Juniper