Week In Review: Auto, Security, Pervasive Computing


Security Ninety-one percent of commercial applications contain outdated or abandoned open-source components —a security threat, says Synopsys in its recently released report 2020 Open Source Security and Risk Analysis (OSSRA). In the fifth annual edition of the report, Synopsys’ research team in its Cybersecurity Research Center (CyRC) found that 99% of the 1,250 commercial codebases revie... » read more

Week In Review: Auto, Security, Pervasive Computing


AI The European Union put out a white paper about artificial intelligence. The United States Chief Technology Officer Michael Kratsios criticized the EU stance on Thursday as clumsy. "We found, what they actually put out yesterday, really, I think, in some ways clumsily attempts to bucket AI-powered technologies as either ‘high-risk’ or ‘not high-risk,’” he said, according to a news ... » read more

October ’19 Startup Funding: Mega Harvest


Seventeen startups took in mega-rounds of $100 million or more during October, with a cumulative total of just over $3.2 billion. Cybersecurity startups continued to be popular with private investors during the month of October, with 15 financing rounds. Twenty automotive and mobility technology firms picked up new investments. Analytics firms, artificial intelligence/machine learning techno... » read more

Week In Review: Design, Low Power


eSilicon debuted its 7nm high-bandwidth interconnect (HBI)+ PHY IP, a special-purpose hard IP block that offers a high-bandwidth, low-power and low-latency wide-parallel, clock-forwarded PHY interface for 2.5D applications such as chiplets. HBI+ PHY delivers a data rate of up to 4.0Gbps per pin. Flexible configurations include up to 80 receive and 80 transmit connections per channel and up to 2... » read more

Creating A Roadmap For Hardware Security


The U.S. Department of Defense and private industry consortiums are developing comprehensive and cohesive cybersecurity plans that will serve as blueprints for military, industrial and commercial systems. What is particularly noteworthy in all of these efforts is the focus on semiconductors. While software can be patched, vulnerabilities such as Spectre, Meltdown and Foreshadow need to be de... » read more

More 2.5D/3D, Fan-Out Packages Ahead


A new wave of 2.5D/3D, fan-out and other advanced IC packages is expected to flood the market over the next year. The new packages are targeted to address many of the same and challenging applications in the market, such as multi-die integration, memory bandwidth issues and even chip scaling. But the new, advanced IC packages face some technical challenges. And cost remains an issue as advan... » read more

Striking the Right Chord for Chiplet Integration


The growing digitalization of our society has made our lives connected and, in many aspects, easier. But the digital revolution also implies that the total amount of data processed in the world is doubling every two years or so. Electronic devices such as mobile phones, laptops, satellites, servers or self-driving vehicles must cope with twice as much data, at higher speeds. Traditional signali... » read more

Packaging Biz Faces Challenges in 2019


The IC packaging industry is bracing for slower growth, if not uncertainty, in 2019, even though advanced packaging remains a bright spot in the market. Generally, IC packaging houses saw strong demand in the first part of 2018, but the market cooled in the second half of the year due to a slowdown in memory. Going forward, the slower IC packaging market is expected to extend into the first ... » read more

The Case For Chiplets


Kandou’s Amin Shokrollahi looks at what’s behind the momentum for a LEGO-like approach, where the challenges are, and how the cost compares with other approaches. https://youtu.be/7QHEeagdLzk     ___________________________________ Find more tech talk videos here .   » read more

Getting Down To Business On Chiplets


Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

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