The Week In Review: Design

By Jesse Allen - 21 Jul, 2017 - Comments: 0

Tools Mentor released the latest version of its FloTHERM CFD software for electronics cooling simulation, adding a new design window to create and solve variants of a model with features to improve scenario definition and design space exploration. Other enhancements include support for Phase Change Materials, more abilities for PCB designs, and an improved parallel solver. Markets IC Insig... » read more

Power/Performance Bits: Dec. 13

By Jesse Allen - 13 Dec, 2016 - Comments: 0

3D porous microsupercapacitors A research team from the King Abdullah University of Science and Technology (KAUST) developed an integrated microsupercapacitor targeted at self-powered system applications where the power source may be intermittent, such as sensors for wearables, security, and structural health monitoring. The key to the microsupercapacitors is vertically-scaled three-dimen... » read more

Power/Performance Bits: Oct. 4

By Jesse Allen - 04 Oct, 2016 - Comments: 0

Solar battery Chemists at the University of Wisconsin–Madison and the King Abdullah University of Science and Technology in Saudi Arabia integrated solar cells with a large-capacity battery in a single device that eliminates the usual intermediate step of making electricity and, instead, transfers the energy directly to the battery's electrolyte. The team used a redox flow battery, or R... » read more

Manufacturing Bits: Aug. 23

By Ed Sperling - 23 Aug, 2016 - Comments: 0

Rolling Out Solar Power...Literally An International team of researchers have developed solar cells that can be added onto a roll of flexible plastic in liquid form, bringing the same kind of economies of production to the solar industry as rolls of paper and ink did for newspapers more than a century ago. Using a roll-to-roll processing method, the team was able to achieve a power conversi... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: King Abdullah University of Science and Technology

The Week In Review: Design

Power/Performance Bits: Dec. 13

Power/Performance Bits: Oct. 4

Manufacturing Bits: Aug. 23