The Week In Review: Design/IoT

By Jesse Allen - 06 Feb, 2015 - Comments: 0

Mergers & Acquistions Silicon Labs acquired Bluegiga Technologies Oy, providers of short-range wireless connectivity solutions and software for the IoT based in Espoo, Finland. Intel signed a definitive agreement to acquire Lantiq, a supplier of broadband access and home networking technologies based in Munich, Germany. Tools Mentor Graphics announced the addition of Automotive ... » read more

Make Vs. Buy

By Ed Sperling - 17 Nov, 2011 - Comments: 0

By Ann Steffora Mutschler The confounding ‘make versus buy’ decision is understandably muddled by design complexity. Millions of gates, thousands of blocks, dozens of cores, plus software, packaging, and worries about physical effects don’t make this decision any easier. In some cases the process can be simplified by mandating that anything that doesn’t add differentiation really is... » read more

Managing IP In Complex Devices

By Ann Mutschler - 17 Nov, 2011 - Comments: 0

By Ann Steffora Mutschler Whether it is a smartphone, tablet, video game with home networking feature or any other digital device, each contains multiple subsystems with a mixture of IP blocks from either in-house development or licensed from third parties. Managing the subsystems, let alone the individual IP blocks and the interplay between all of them, is not getting any easier. In fact, wit... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Lantiq

The Week In Review: Design/IoT

Make Vs. Buy

Managing IP In Complex Devices