Manufacturing Bits: Sept. 20

By Mark LaPedus - 20 Sep, 2016 - Comments: 0

Crystal database The University of California at San Diego and Lawrence Berkeley National Laboratory have created an open-source database of elemental crystal surfaces and shapes. The database, called Crystalium, is a new and expanding set of information about various crystals. The database can help researchers design new materials for various applications, such as batteries, catalytic conv... » read more

Power/Performance Bits: Dec. 1

By Jesse Allen - 01 Dec, 2015 - Comments: 0

Hiding wires from the sun There's a problem with most solar cells: the electricity-carrying metal wire grid on top prevents sunlight from reaching the semiconductor below. A team from Stanford University tackled this problem, discovering a way to hide the reflective upper contact and funnel light directly to the semiconductor below. For the study, the researchers placed a 16-nanometer-thi... » read more

Power/Performance Bits: Dec. 16

By Ann Mutschler - 16 Dec, 2014 - Comments: 0

Measuring electrons in silicon In what is believed to be a first, a team of physicists and chemists based at UC Berkeley, Ludwig-Maximilians Universität in Munich, Germany, the University of Tsukuba, Japan, and the Molecular Foundry at the Department of Energy’s Lawrence Berkeley National Laboratory has captured images of electrons breaking free of their atomic shells using attosecond pulse... » read more

Manufacturing Bits: June 10

By Ed Sperling - 10 Jun, 2014 - Comments: 2

Self-Assembling Nano Films Applying thin films with uniformity has always been an engineering challenge, but as feature sizes shrink the problem become even more pronounced. But a new approach developed by Lawrence Berkeley National Labs’ Materials Science Division could end up simplifying this process. The new approach used chloroform as an annealing solvent to create self-assembling arr... » read more

Manufacturing Bits: Jan. 14

By Mark LaPedus - 14 Jan, 2014 - Comments: 0

MoS2 FETs Two-dimensional materials are gaining steam in the R&D labs. The 2D materials include graphene, boron nitride (BN) and the transition-metal dichalcogenides (TMDs). One TMD, molybdenum diselenide (MoS2), is an attractive material for use in future field-effect transistors (FETs). MoS2 has several properties, including a non-zero band gap, atomic scale thickness and pristine int... » read more

Power/Performance Bits: Dec. 10

By Brian Bailey - 10 Dec, 2013 - Comments: 0

Optical Metamaterial with a Refractive Index of Zero Most of the time we hear about the need for coherent light sources, such as those produced by lasers, but there may be equal promise looking in the other direction. Quantum processors promise to be many times faster and more powerful than today’s supercomputers, but to get to that point they will need fast and efficient multi-directiona... » read more

Manufacturing Bits: Nov. 19

By Mark LaPedus - 19 Nov, 2013 - Comments: 0

Toothpick Fab Tools NASA's Goddard Space Flight Center in Greenbelt, Md. has developed a specialized atomic layer deposition (ALD) system and a "virtual toothpick" to enable ultra-thin films on chips and systems. NASA has built an ALD reactor chamber, which measures three inches in diameter and two feet in length. The system can deposit films inside pores and cavities, giving ALD the abilit... » read more

Manufacturing Bits: July 9

By Mark LaPedus - 09 Jul, 2013 - Comments: 0

Fishy Robots National University of Singapore (NUS) has developed a robotic fish that mimics the movements of a carp—a technology that could pave the way for more efficient autonomous underwater vehicles. This robot is classified as an autonomous underwater vehicle (AUV). Applications include military, pipeline leakage detection, and the laying of communication cable. The robot could be u... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Lawrence Berkeley National Laboratory