Chip Industry Week In Review

By The SE Staff - 17 May, 2024 - Comments: 0

President Biden will raise the tariff rate on Chinese semiconductors from 25% to 50% by 2025, among other measures to protect U.S. businesses from China’s trade practices. Also, as part of President Biden’s AI Executive Order, the Administration released steps to protect workers from AI risks, including human oversight of systems and transparency about what systems are being used. Intel ... » read more

Week In Review: Design, Low Power

By Jesse Allen - 16 Dec, 2022 - Comments: 0

Power always has been a function of cost. The more power required, the more it costs to run a device, both in dollars and carbon footprint. This makes the breakthrough in fusion ignition at Lawrence Livermore National Laboratory all the more noteworthy, and one that could have significant implications for the future of computing, from data centers to rechargeable batteries in automobiles, robot... » read more

Technical Paper Round-Up: April 5

By Linda Christensen - 05 Apr, 2022 - Comments: 0

Neuromorphic chips, transistor defect detection, quantum, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity top the past week's technical papers. They also point to a rising level of government investment, and collaborations between schools that historically haven't worked closely together, including one that involves schools on different continents. ... » read more

Chiplets Enter The Supercomputer Race

By Mark LaPedus - 17 Mar, 2022 - Comments: 0

Several entities from various nations are racing each other to deliver and deploy chiplet-based exascale supercomputers, a new class of systems that are 1,000x faster than today’s supercomputers. The latest exascale supercomputer CPU and GPU designs mix and match complex dies in advanced packages, adding a new level of flexibility and customization for supercomputers. For years, various na... » read more

Week In Review: Design, Low Power

By Jesse Allen - 23 Dec, 2021 - Comments: 0

Deals Utilidata and Nvidia are teaming up on a software-defined smart grid chip that can be embedded in smart meters to with the aim of improving grid resiliency and integrating distributed energy resources (DERs) such as solar, storage, and electric vehicles. The U.S. Department of Energy’s National Renewable Energy Laboratory (NREL) will test the software-defined smart grid chip as a way t... » read more

Manufacturing Bits: Nov. 8

By Mark LaPedus - 08 Nov, 2021 - Comments: 0

Plasma R&D with quantum computing Rigetti Computing, a developer of quantum computers, has been selected to lead a quantum simulation project for the development of fusion energy. The project was awarded by the Department of Energy (DoE). Under the plan, Rigetti will collaborate with Lawrence Livermore National Laboratory and the University of Southern California on a three-year, $3.1 m... » read more

Manufacturing Bits: Nov. 3

By Mark LaPedus - 03 Nov, 2020 - Comments: 0

Zeptosecond measurements A group of researchers have set a new world’s record for the shortest timespan measurement. DESY, Fritz-Haber-Institute and Goethe University Frankfurt have measured how long it takes for a photon to cross a hydrogen molecule. The result? About 247 zeptoseconds. A zeptosecond is a trillionth of a billionth of a second (10-21 seconds). This is said to be the sh... » read more

Manufacturing Bits: May 11

By Mark LaPedus - 11 May, 2020 - Comments: 0

Covid-19 data mining Using machine learning and other technologies, Lawrence Berkeley National Laboratory (Berkeley Lab) has developed a data text-mining tool to help synthesize a growing amount of scientific literature on Covid-19. Each day, some 200 new journal articles are being published on the coronavirus alone, according to Berkeley Lab. Berkeley Lab’s data mining tool, which is liv... » read more

Manufacturing Bits: Feb. 25

By Mark LaPedus - 25 Feb, 2020 - Comments: 0

Diamond finFETs HRL Laboratories has made new and significant progress to develop diamond finFETs. HRL, a joint R&D venture between Boeing and General Motors, has developed a new ohmic regrowth technique for diamond FETs. This in turn could pave the way towards commercial diamond FETs. Applications include spacecraft, satellites and systems with extreme temperatures. Still in R&D, diamo... » read more

Manufacturing Bits: Feb. 10

By Mark LaPedus - 10 Feb, 2020 - Comments: 0

Accelerating and cooling muons Using a novel particle accelerator, a group for the first time have observed a phenomenon called muon ionization cooling–an event that could give researchers a better understanding of matter and the universe. Muons are obscure sub-atomic particles. This experiment could pave the way towards the development of new and powerful muon particle accelerators. Thes... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Lawrence Livermore National Laboratory

Chip Industry Week In Review

Week In Review: Design, Low Power

Technical Paper Round-Up: April 5

Chiplets Enter The Supercomputer Race

Week In Review: Design, Low Power

Manufacturing Bits: Nov. 8

Manufacturing Bits: Nov. 3

Manufacturing Bits: May 11

Manufacturing Bits: Feb. 25

Manufacturing Bits: Feb. 10

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