Recent technical papers include neuromorphic chips, transistor defect detection, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity.
Neuromorphic chips, transistor defect detection, quantum, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity top the past week’s technical papers. They also point to a rising level of government investment, and collaborations between schools that historically haven’t worked closely together, including one that involves schools on different continents.
New studies from NIST, Lawrence Livermore National Lab, USC’s Viterbi School of Engineering, NAIST, QuTech, Delft University of Technology, Lawrence Berkeley National Lab, University of Florida, University of Mons, Leeds Beckett University and more.
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