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Technical Paper Round-Up: April 5


Neuromorphic chips, transistor defect detection, quantum, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity top the past week's technical papers. They also point to a rising level of government investment, and collaborations between schools that historically haven't worked closely together, including one that involves schools on different continents. ... » read more

Investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages


Abstract "Copper wire bonding has got attracted attention over gold wire bonding due to its lower cost. However, despite many unique aspects and properties of copper wire bonding, corrosion of copper wire bonding has become a point of interest as it leads to the failure of semiconductor packages. Current and future trends and development in miniaturization and multifunction of the semico... » read more