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Technical Paper Round-Up: April 5


Neuromorphic chips, transistor defect detection, quantum, pellicles, BEV mobile charging, copper wire bonding, LrWPAN, batteries and superconductivity top the past week's technical papers. They also point to a rising level of government investment, and collaborations between schools that historically haven't worked closely together, including one that involves schools on different continents. ... » read more

Neuromorphic chip integrated with a large-scale integration circuit and amorphous-metal-oxide semiconductor thin-film synapse devices


New academic paper from Nara Institute of Science and Technology (NAIST) and Ryukoku University. Abstract "Artificial intelligences are promising in future societies, and neural networks are typical technologies with the advantages such as self-organization, self-learning, parallel distributed computing, and fault tolerance, but their size and power consumption are large. Neuromorphic syste... » read more