Why Would IBM Sell Its Semi Group?

By Ed Sperling - 20 Feb, 2014 - Comments: 1

Rumors are always just rumors until proven otherwise in business, but in the case of IBM’s semiconductor business, hints about the sale of its semiconductor business are particularly noteworthy. Much has changed since the days when IBM—as International Business Machines—went head-to-head with AT&T’s quasi-public Bell Labs and Xerox’s Palo Alto Research Center (PARC). The breakup of... » read more

Week In Review: Manufacturing And Design

By Mark LaPedus - 20 Dec, 2013 - Comments: 0

Wearable computing is one of the hottest topics being discussed today. Angela McIntyre, research director at Gartner, said digital health and fitness will be among the hottest segments in the arena. Don't look now, but ASML Holding has delayed its 450mm tool programs. "As for 450, ASML has paused the development of 450mm lithography systems, both EUV and 193, until customer demand and the ti... » read more

Manufacturing Bits: Dec. 17

By Mark LaPedus - 17 Dec, 2013 - Comments: 0

Implantable TFETs At the recent IEEE International Electron Devices Meeting (IEDM) in Washington, D.C., a number of companies, R&D organizations and universities described new breakthroughs in perhaps the next big thing in semiconductors--the tunnel field-effect transistor (TFET). Aimed for the 5nm node, TFETs are steep sub-threshold slope transistors that can scale the supply voltages bel... » read more

DSA, Multi-beam Make Steady Progress

By Mark LaPedus - 12 Dec, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss current and future lithography challenges with Laurent Pain, lithography lab manager at CEA-Leti. What follows are excerpts of that conversation. SE: CEA-Leti has two major programs in lithography. One is in directed self-assembly (DSA) and the other is in multi-beam e-beam. Let’s start with multi-beam. What is Leti doing in multi-beam and what... » read more

VLSI Kyoto – The SOI Papers

By Various Writers - 19 Jun, 2013 - Comments: 0

By Adele Hars There were some breakthrough FD-SOI and other excellent SOI-based papers that came out of the 2013 Symposia on VLSI Technology and Circuits in Kyoto (June 10-14, 2013). By way of explanation, VSLI comprises two symposia: one on Technology; one on Circuits. However, papers that are relevant to both were presented in “Jumbo Joint Focus” sessions. The papers should all b... » read more

ST-Ericsson 28nm FD-SOI/ARM Chip Hits 2.8GHz at CES

By Various Writers - 22 Jan, 2013 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ What a great start to 2013: at CES in Las Vegas, ST-Ericsson announced the NovaThor™ L8580 ModAp, “the world’s fastest and lowest-power integrated LTE smartphone platform.” This is the one that’s on STMicroelectronics’ 28nm FD-SOI, with sampling set for Q1 2013. And it’s a game changer – for users, fo... » read more

Don’t miss Fully-Depleted Tech Symposium during IEDM (SF)

By Various Writers - 04 Dec, 2012 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ If you want to cut through the noise surrounding the choices for 28nm and beyond, an excellent place to start is the SOI Consortium’s Fully Depleted Technology Symposium. As a member of the design and manufacturing communities, this is your chance to see and hear what industry leaders are actually doing. Planar? F... » read more

Wafer Leaders Extend Basis for Global SOI Supply

By Various Writers - 16 Oct, 2012 - Comments: 0

Posted by Adele Hars, Editor-in-Chief, Advanced Substrate News ~ ~ It’s a bright green light from the world leaders in SOI wafer capacity. Soitec, the world leader in SOI wafer production, and long-time partner Shin-Etsu Handatai (SEH), the world’s biggest producer of silicon wafers, have extended their licensing agreement and expanded their technology cooperation. SEH is a $12... » read more

SPOTLIGHT ON FD-SOI, FINFETS AT IEEE SOI CONFERENCE ;1-4 OCT, NAPA

By Various Writers - 25 Sep, 2012 - Comments: 0

The 38th annual SOI Conference is coming right up. Sponsored by IEEE Electron Devices Society, this is the only dedicated SOI conference covering the full technology chain from materials to devices, circuits and system applications. Chaired this year by Gosia Jurczak (manager of the Memories Program at imec), this excellent conference is well worth attending. It’s where the giants of the ... » read more

Power And Performance: GSS Sees SOI Advantages For FinFETs

By Various Writers - 17 Sep, 2012 - Comments: 0

Are FinFETs better on SOI? In a series of papers, high-profile blogs and subsequent media coverage,Gold Standard Simulations (aka GSS) has indicated that, yes, FinFETs should indeed be better on SOI. To those of us not deeply involved in the research world, much of this may seem to come out of nowhere. But there’s a lot of history here, and in this blog we’ll take a look at what it’s... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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