Manufacturing Bits: May 9

By Mark LaPedus - 09 May, 2017 - Comments: 0

China’s quantum computer In its latest achievement, China has built a quantum computer. With its technology, the University of Science and Technology of China and Zhejiang University claimed to have set two records in quantum computing. In classical computing, the information is stored in bits, which can be either a “0” or “1”. In quantum computing, information is stored in quant... » read more

What Does An AI Chip Look Like?

By Ed Sperling - 01 Mar, 2017 - Comments: 5

Depending upon your point of reference, artificial intelligence will be the next big thing or it will play a major role in all of the next big things. This explains the frenzy of activity in this sector over the past 18 months. Big companies are paying billions of dollars to acquire startup companies, and even more for R&D. In addition, governments around the globe are pouring additional... » read more

New Memories And Architectures Ahead

By Brian Bailey - 13 Feb, 2017 - Comments: 4

Memory dominates many SoCs, and it is rare to hear that a design contains too much memory. However, memories consume a significant percentage of system power, and while this may not be a critical problem for many systems, it is a bigger issue for Internet of Things ([getkc id="76" kc_name="IoT"]) edge devices where total energy consumption is very important. Memory demands are changing in al... » read more

What’s Next For Transistors

By Mark LaPedus - 23 Jan, 2017 - Comments: 1

The IC industry is moving in several different directions at once. The largest chipmakers continue to march down process nodes with chip scaling, while others are moving towards various advanced packaging schemes. On top of that, post-CMOS devices, neuromorphic chips and quantum computing are all in the works. Semiconductor Engineering sat down to discuss these technologies with Marie Semeri... » read more

Smart Manufacturing Gains Momentum

By Ed Sperling - 05 Jan, 2017 - Comments: 0

Smart manufacturing is gaining traction as a way of addressing increased market fragmentation while still leveraging economies of scale. The goal is to add a level of flexibility into manufacturing processes that until recently was considered impossible. Although the approach makes sense in theory, real-world implementation is proving far from consistent. Sometimes referred to as Industr... » read more

Uncertainty Grows For 5nm, 3nm

By Mark LaPedus - 19 Dec, 2016 - Comments: 4

As several chipmakers ramp up their 10nm finFET processes, with 7nm just around the corner, R&D has begun for 5nm and beyond. In fact, some are already moving full speed ahead in the arena. [getentity id="22586" comment="TSMC"] recently announced plans to build a new fab in Taiwan at a cost of $15.7 billion. The proposed fab is targeted to manufacture TSMC’s 5nm and 3nm processes, whic... » read more

5 Takeaways from IEDM

By Mark LaPedus - 15 Dec, 2016 - Comments: 1

As usual, the recent IEEE International Electron Devices Meeting (IEDM) was a busy week. The event, which took place in San Francisco, featured a plethora of subjects, such as next-generation transistors and memories. The event also included tracks on non-traditional approaches like quantum and neuromorphic computing. And then, there were sessions on power semis and others. In no partic... » read more

Manufacturing Bits: Dec. 6

By Mark LaPedus - 06 Dec, 2016 - Comments: 1

The National High Magnetic Field Laboratory (MagLab) has broken an unofficial record for the world’s most powerful hybrid magnet. The 33-ton system, called the series connected hybrid (SCH) magnet, has reached its full field strength of 36 tesla. The SCH is more than 40% stronger than the previous world-record hybrid magnet. Tesla, or T, is the measurement of magnetic field strength. A ref... » read more

Manufacturing Bits: Nov. 23

By Mark LaPedus - 23 Nov, 2016 - Comments: 1

Materials database The Department of Energy’s Lawrence Berkeley National Laboratory has published a study that quantifies the thermodynamic scale of metastability of some 29,902 materials. To quantify the materials, researchers used Berkeley Lab’s Materials Project, a large and open database of known and predicted materials. The open and Web-based database has calculated the properties ... » read more

Partitioning For Power

By Ed Sperling - 14 Nov, 2016 - Comments: 0

Examine any smartphone design today and most of the electronic circuitry is "off" most of the time. And regardless of how many processor cores are available, it's rare to use more than a couple of those cores at any point in time. The emphasis is shifting, though, as the mobility market flattens and other markets such as driver-assisted vehicles and IoT begin gaining traction. In a car, turn... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

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