SiC Power Electronics Packaging: Floating Die Structure and Liquid Metal Fluidic Connection (Cambridge U. )


A new technical paper titled "Liquid Metal Fluidic Connection and Floating Die Structure for Ultralow Thermomechanical Stress of SiC Power Electronics Packaging" was published by researchers at Cambridge University. Abstract "Coefficients of thermal expansion (CTE) of various materials in packaging structure layers vary largely, causing significant thermomechanical stress in power electroni... » read more

Research Bits: June 18


Gallium nitride can take the heat Researchers from Massachusetts Institute of Technology (MIT), the UAE's Technology Innovation Institute, Ohio State University, Rice University, and Bangladesh University of Engineering and Technology investigated the performance of ohmic contacts in a gallium nitride (GaN) device at extremely high temperatures, such as those that would be required for devices... » read more

Rubbery Schottky Diodes Based on Soft, Stretchy Electronic Materials (Penn State)


A new technical paper titled "Fully rubbery Schottky diode and integrated devices" was published by researchers at Penn State University. The Office of Naval Research and the National Science Foundation funded this research. "Here, we report a fully rubbery Schottky diode constructed all based on stretchable electronic materials, including a liquid metal cathode, a rubbery semiconductor, and... » read more

Mass Production of Soft And Stretchable Electronics


This new technical paper titled "Scalable Manufacturing of Liquid Metal Circuits" was published by researchers at Carnegie Mellon University. The work presents "a novel technique for scalable and reproducible manufacturing of LM-based SSEs [soft and stretchable electronics] with integrated solid-state microelectronic components. The manufacturing technique is based on a selective metal-alloy... » read more

Miniaturized Liquid Metal-based Flexible Electrochemical Detection System on Fabric


Researchers from Beihang University (Beijing), Zhejiang University, and Tsinghua University. Abstract "Integrated electrochemical sensing platforms in wearable devices have great prospects in biomedical applications. However, traditional electrochemical platforms are generally fabricated on airtight printed circuit boards, which lack sufficient flexibility, air permeability, and conformab... » read more