The Week in Review: IoT

By Jeff Dorsch - 02 Mar, 2018 - Comments: 0

Finance CyberX raised $18 million in Series B funding, bringing its total funding to $30 million. Norwest Venture Partners led the new round and was joined by ff Venture Capital, Flint Capital, Glilot Capital Partners, and OurCrowd. CyberX makes its headquarters in Framingham, Mass., with operations in Israel. The startup offers security protection for Industrial Internet of Things application... » read more

The Route To 5G

By Arm - 09 Nov, 2016 - Comments: 0

The mobile phone has seen explosive growth over the last two decades to become an essential part of our everyday lives. Right from the outset, ARM has been at the heart of these devices enabling ever more sophisticated capabilities whilst maintaining a focus on maximizing battery life through industry leading power efficiency. The complexity of smartphones is not often fully appreciated, with ... » read more

Making Phones Better

By Mattan Kamon - 18 Aug, 2016 - Comments: 0

Beneath a smartphone's slick packaging is some interesting, highly sophisticated technology that makes the user experience what it is today. Much of that experience relies on satisfying our ever growing desire for more data capacity for video, social media and the like. Providing that capacity relies on robust filtering to receive just your data stream amongst many nearby other streams. But tha... » read more

Designing An Efficient Multi-Core LTE-A Modem

By Various Writers - 12 Feb, 2014 - Comments: 0

LTE-Advanced represents the next generation mobile broadband, and in turn throws the challenge to the designers to create highly power efficient mobile devices capable of delivering these services. ARM, the leading supplier of embedded processors, physical IP and inter-connect fabric, along with CEVA propose a joint analysis looking at the design considerations that are required to realize the ... » read more

Different Tradeoffs

By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Ed Sperling The push to “smaller, faster and cheaper” hasn’t changed since ICs were first introduced, but the context for those requirements is beginning to shift—with enormous consequences. What was once done on multiple chips continue to migrate to a single chip or package because of cost, but in some cases the decisions about goes where go well beyond an individual device to i... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: LTE Advanced

The Week in Review: IoT

The Route To 5G

Making Phones Better

Designing An Efficient Multi-Core LTE-A Modem

Different Tradeoffs