Choosing The Right Interconnect


Efforts to zero in on cheaper advanced packaging approaches that can speed time to market are being sidetracked by a dizzying number of choices. At the center of this frenzy of activity is the [getkc id="36" kc_name="interconnect"]. Current options range from organic, silicon and glass interposers, to bridges that span different die at multiple levels. There also are various fan-out approach... » read more

Artificial, With Questionable Intelligence


A common theme is emerging in the race to develop big machines that can navigate through a world filled with people, animals, and other assorted objects—if an accident is inevitable, what options are available to machines and how should they decide?   This question was raised at a number of semiconductor industry conferences over the past few weeks, which is interesting because this idea h... » read more

The Week in Review: IoT


Regulation The Consumer Product Safety Commission is accepting public comments on “potential safety issues and hazards associated with Internet-connected consumer products.” The agency is concerned about “unexpected operating conditions” with Internet of Things devices, along with hacking that could start fires through a stovetop or grill, and the potential compromising of home safety ... » read more

When AI Goes Awry


The race is on to develop intelligent systems that can drive cars, diagnose and treat complex medical conditions, and even train other machines. The problem is that no one is quite sure how to diagnose latent or less-obvious flaws in these systems—or better yet, to prevent them from occurring in the first place. While machines can do some things very well, it's still up to humans to devise... » read more

Applying Machine Learning To Chips


The race is on to figure out how to apply analytics, data mining and machine learning across a wide swath of market segments and applications, and nowhere is this more evident than in semiconductor design and manufacturing. The key with ML/DL/AI is understanding how devices react to real events and stimuli, and how future devices can be optimized. That requires sifting through an expandi... » read more

System Bits: March 20


Design has consequences Carnegie Mellon University design students are exploring ways to enhance interactions with new technologies and the power of artificial intelligence. Assistant Professor Dan Lockton teaches the course, "Environments Studio IV: Designing Environments for Social Systems" in CMU's School of Design and leads the school's new Imaginaries Lab. “We want the designers of ... » read more

AI: The Next Big Thing


The next big thing isn't actually a thing. It's a set of finely tuned statistical models. But developing, optimizing and utilizing those models, which collectively fit under the umbrella of artificial intelligence, will require some of the most advanced semiconductors ever developed. The demand for artificial intelligence is almost ubiquitous. As with all "next big things," it is a horizonta... » read more

Intelligence At The Edge Is Transforming Our World


Innovation comes in all forms in technology, from software and hardware to displays all the way to the human-machine interface. As devices and systems become more intelligent, the onus on humans to learn the machine’s ways is shifting. Until now, interaction with smart devices has largely relied on our ability to manipulate the machines; to learn their language to input and extract the inform... » read more

Mobile Machine Learning At Arm


Machine learning is playing an increasingly significant role in emerging mobile application domains such as AR/VR, ADAS, etc. Accordingly, hardware architects have designed customized hardware for machine learning algorithms, especially neural networks, to improve compute efficiency. However, machine learning is typically just one processing stage in complex end-to-end applications, which invol... » read more

Is Advanced Packaging The Next SoC?


Device scaling appears to be possible down to 1.2nm, and maybe even beyond that. What isn't obvious is when scaling will reach that node, how many companies will actually use it, or even what chips will look like when foundries actually start turning out these devices using multi-patterning with high-NA EUV and dielectrics with single-digit numbers of atoms. There are two big changes playing... » read more

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