Startup Funding: January 2021

By Jesse Allen - 03 Feb, 2021 - Comments: 0

Over $800M in funding went to companies developing autonomous driving technology, from self-driving-focused AI chips to full vehicles and aftermarket solutions. A couple electric vehicle manufacturers stood out this month, with investors putting large backing behind US-based Rivian and China-based Leapmotor. And with EVs come lots of batteries: funding went to a few startups trying out new batt... » read more

May’19 Startup Funding: Mega-Funding Rounds Continue

By Jeff Dorsch - 05 Jun, 2019 - Comments: 0

In May, 20 startups enjoyed the distinction of getting a mega-round of $100 million or more in private funding. Those 20 companies together took in more than $6.65 billion. There were two billion-dollar investments in recent weeks. GM Cruise, the autonomous vehicle startup, received $1.15 billion in new funding from General Motors, Honda Motor, the SoftBank Vision Fund, T. Rowe Price Asso... » read more

EUV Mask Blank Battle Brewing

By Mark LaPedus - 15 Nov, 2018 - Comments: 2

Amid the ramp of extreme ultraviolet (EUV) lithography in the market, suppliers of EUV mask blanks are expanding their production. And a new player—Applied Materials—is looking to enter the market. AGC and Hoya, the two main suppliers of EUV mask blanks, are adding capacity for these critical components that are used for EUV photomasks. A mask blank serves as the substrate for a photomas... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 05 Oct, 2018 - Comments: 0

Internet of Things Amazon Web Services announced that Iridium Communications has joined the AWS Partner Network. AWS and Iridium have collaborated on development of Iridium CloudConnect, a service that enables worldwide coverage for Internet of Things applications through Iridium’s satellite network. AWS IoT is being paired with Iridium IoT services as a result. IHS Markit forecasts there wi... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Macquarie Group

Startup Funding: January 2021

May’19 Startup Funding: Mega-Funding Rounds Continue

EUV Mask Blank Battle Brewing

Week in Review: IoT, Security, Auto

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