Hunting For Hardware-Related Errors In Data Centers


The semiconductor industry is urgently pursuing design, monitoring, and testing strategies to help identify and eliminate hardware defects that can cause catastrophic errors. Corrupt execution errors, also known as silent data errors, cannot be fully isolated at test — even with system-level testing — because they occur only under specific conditions. To sort out the environmental condit... » read more

Advanced High Throughput e-Beam Inspection With DirectScan


Optical inspection cannot resolve critical defects at advanced nodes and cannot detect subsurface defects. Especially at 7nm and below, many yield and reliability killer defects are the result of interactions between lithography, etch, and fill. These defects often will have part per billion (PPB) level fail rates. Conventional eBeam tools lack the throughput to measure PPB level fail rates. A ... » read more

A Study Of Wiggling AA Modeling And Its Impact On Device Performance In Advanced DRAM


In this paper, a wiggling active area (fin) in an advanced 1x DRAM process was analyzed and modeled using the pattern-dependent etch simulation capabilities of the SEMulator3D semiconductor modeling software. Nonuniformity in sidewall passivation caused by hard mask pattern density loading was identified as the root cause of the wiggling profile. The calibrated model mimicked these phenomena, g... » read more

Power/Performance Bits: Oct. 29


Chip scanning Researchers at the University of Southern California and the Paul Scherer Institut in Switzerland developed an x-ray technique to non-destructively scan chips to make sure they conform to specifications. Such a system could be used to identify manufacturing defects or malicious alterations, the team said. Called ptychographic x-ray laminography, the technique utilizes x-rays f... » read more