Machine Learning Meets IC Design

By Brian Bailey - 29 Jun, 2017 - Comments: 2

Machine Learning (ML) is one of the hot buzzwords these days, but even though EDA deals with big-data types of issues it has not made much progress incorporating ML techniques into EDA tools. Many EDA problems and solutions are statistical in nature, which would suggest a natural fit. So why is it so slow to adopt machine learning technology, while other technology areas such as vision recog... » read more

Teaching Computers To See

By Ann Mutschler - 16 Nov, 2016 - Comments: 0

Vision processing is emerging as a foundation technology for a number of high-growth applications, spurring a wave of intensive research to reduce power, improve performance, and push embedded vision into the mainstream to leverage economies of scale. What began as a relatively modest development effort has turned into an all-out race for a piece of this market, and for good reason. Mark... » read more

The Week In Review: IoT

By Jeff Dorsch - 16 Sep, 2016 - Comments: 0

Deals Verizon Communications agreed to acquire Sensity Systems of Sunnyvale, Calif., a supplier of energy-efficient light-emitting diode lighting equipment to serve as the foundation for its Internet of Things platform for smart cities; financial terms weren’t disclosed. The transaction is expected to close in the fourth quarter. Mike Lanman, Verizon’s senior vice president of Enterprise P... » read more

Neuromorphic Chip Biz Heats Up

By Mark LaPedus - 21 Jan, 2016 - Comments: 0

It’s no secret that today’s computers are struggling to keep up with the enormous demands of data processing and bandwidth, and the whole electronics industry is searching for new ways to enable that. The traditional approach is to continue to push the limits of today’s systems and chips. Another way is to go down the non-traditional route, including an old idea that is generating stea... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Markets and Markets

Machine Learning Meets IC Design

Teaching Computers To See

The Week In Review: IoT

Neuromorphic Chip Biz Heats Up