Reducing Advanced Packaging Costs

By Ed Sperling - 09 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Where Advanced Packaging Makes Sense

By Ed Sperling - 10 Dec, 2018 - Comments: 0

Affordable Design With Wireless Microcontrollers

By Sree Durbha - 06 Dec, 2018 - Comments: 0

Today, we are at the peak of technology product availability with the releases of the new iPhone models, Alexa-enabled devices, and more. In the coming days, there will be numerous international consumer OEMs preparing new offerings as we approach the holiday selling season. Along with the smartphones, voice assistant enabled smart speakers and deep learning wireless security cameras, many devi... » read more

VM Aware Fibre Channel Virtual Machine Traffic Visibility for SANs

By Marvell - 05 Dec, 2018 - Comments: 0

Mysteries of the world, such as how the Monarch butterflies can find their way migration paths all the way back to their species’ origination point even though they had never been there before, but these occurrences in nature should remain a complete mystery. With VM clusters generating an increasing amount of FC traffic that crisscrosses across SANs within enterprise/datacenter ecosystem, th... » read more

Making Sure A Heterogeneous Design Will Work

By Ed Sperling - 03 Dec, 2018 - Comments: 0

An explosion of various types of processors and localized memories on a chip or in a package is making it much more difficult to verify and test these devices, and to sign off with confidence. In addition to timing and clock domain crossing issues, which are becoming much more difficult to deal with in complex chips, some of the new devices are including AI, machine learning or deep learning... » read more

Delivering Superior Throughput For EDA Verification Workloads

By Cadence - 28 Nov, 2018 - Comments: 0

Perhaps no industry is more competitive than modern electronics manufacturing and chip design. As consumers, we take it for granted that electronic devices continue to get faster, cheaper, and more capable with each generation. From smart watches to industrial controls to electronic heart-rate monitors, electronics manufacturers are challenged to build smarter, more complex devices leveraging s... » read more

Getting Down To Business On Chiplets

By Ed Sperling - 26 Nov, 2018 - Comments: 0

Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 21 Nov, 2018 - Comments: 0

R&D Imec and CEA-Leti have signed a memorandum of understanding under which the two R&D organizations will form a strategic partnership in the domains of artificial intelligence and quantum computing. Europe hopes to accelerate its effort in both AI and quantum computing. Market research TrendForce announced the ranking of top 10 fabless IC design houses worldwide based on their revenues f... » read more

How To Automate A Parking Lot

By Maen Suleiman - 01 Nov, 2018 - Comments: 1

By Maen Suleiman and Gorka Garcia Applications at the edge of the network require special technologies, such as efficient packet processing, machine learning and connectivity to the cloud. The edge crosses a multitude of markets, including small business, industrial and enterprise, and it can include everything from devices you might expect to find at the edge to unusual concepts such as... » read more

Cracking The Auto IC Market

By Ann Mutschler - 06 Sep, 2018 - Comments: 0

The market for automotive electronics is booming, and it has set off a global scramble among established chipmakers and startups. What's becoming clear, though, is that not everyone understands just how different automotive is from the mobile market. Mobile is still the highest-volume market for semiconductors, but the growth has flattened. In contrast, the value of the automotive electronic... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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