Week in Review: Design, Low Power

By Susan Rambo - 08 Feb, 2019 - Comments: 0

The U.S. Department of Energy (DOE) has awarded $35 million for 12 projects involving ultra-efficient power management. Called Arpa-E, the program encouraged participants to use medium-voltage electricity in new ways with real-world applications, such as industry, transportation and the grid. The top two award winners were Eaton Corp. (Arden, NC) for its DC wide-bandgap static circuit breaker, ... » read more

Making Autonomous Vehicles Safer

By Kevin Fogarty - 10 Jan, 2019 - Comments: 2

While self-driving vehicles are beta-tested on some public roads in real traffic situations, the semiconductor and automotive industries are still getting a grip on how to test and verify that vehicle electronics systems work as expected. Testing can be high stakes, especially when done in public. Some of the predictions about how humans will interact with autonomous vehicles (AVs) on public... » read more

Reducing Advanced Packaging Costs

By Ed Sperling - 09 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Where Advanced Packaging Makes Sense

By Ed Sperling - 10 Dec, 2018 - Comments: 0

Affordable Design With Wireless Microcontrollers

By Sree Durbha - 06 Dec, 2018 - Comments: 0

Today, we are at the peak of technology product availability with the releases of the new iPhone models, Alexa-enabled devices, and more. In the coming days, there will be numerous international consumer OEMs preparing new offerings as we approach the holiday selling season. Along with the smartphones, voice assistant enabled smart speakers and deep learning wireless security cameras, many devi... » read more

VM Aware Fibre Channel Virtual Machine Traffic Visibility for SANs

By Marvell - 05 Dec, 2018 - Comments: 0

Mysteries of the world, such as how the Monarch butterflies can find their way migration paths all the way back to their species’ origination point even though they had never been there before, but these occurrences in nature should remain a complete mystery. With VM clusters generating an increasing amount of FC traffic that crisscrosses across SANs within enterprise/datacenter ecosystem, th... » read more

Making Sure A Heterogeneous Design Will Work

By Ed Sperling - 03 Dec, 2018 - Comments: 0

An explosion of various types of processors and localized memories on a chip or in a package is making it much more difficult to verify and test these devices, and to sign off with confidence. In addition to timing and clock domain crossing issues, which are becoming much more difficult to deal with in complex chips, some of the new devices are including AI, machine learning or deep learning... » read more

Delivering Superior Throughput For EDA Verification Workloads

By Cadence - 28 Nov, 2018 - Comments: 0

Perhaps no industry is more competitive than modern electronics manufacturing and chip design. As consumers, we take it for granted that electronic devices continue to get faster, cheaper, and more capable with each generation. From smart watches to industrial controls to electronic heart-rate monitors, electronics manufacturers are challenged to build smarter, more complex devices leveraging s... » read more

Getting Down To Business On Chiplets

By Ed Sperling - 26 Nov, 2018 - Comments: 0

Government agencies, industry groups and individual companies are beginning to rally around various chiplet models, setting the stage for complex chips that are quicker and cheaper to build using standardized interfaces and components. The idea of putting together different modules like LEGOs has been talked about for the better part of a decade. So far, only Marvell has used this concept co... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 21 Nov, 2018 - Comments: 0

R&D Imec and CEA-Leti have signed a memorandum of understanding under which the two R&D organizations will form a strategic partnership in the domains of artificial intelligence and quantum computing. Europe hopes to accelerate its effort in both AI and quantum computing. Market research TrendForce announced the ranking of top 10 fabless IC design houses worldwide based on their revenues f... » read more

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tag: Marvell

Week in Review: Design, Low Power

Making Autonomous Vehicles Safer

Reducing Advanced Packaging Costs

Where Advanced Packaging Makes Sense

Affordable Design With Wireless Microcontrollers

VM Aware Fibre Channel Virtual Machine Traffic Visibility for SANs

Making Sure A Heterogeneous Design Will Work

Delivering Superior Throughput For EDA Verification Workloads

Getting Down To Business On Chiplets

Week In Review: Manufacturing, Test

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