tag: Marvell

Getting Data Centers Ready For Composable Infrastructure
By George Hervey - 04 Apr, 2019 - Comments: 0

The data center networking landscape is set to change dramatically. More adaptive and operationally efficient composable infrastructure will soon start to see significant uptake, supplanting the traditional inflexible, siloed data center arrangements of the past and ultimately leading to universal adoption. Composable infrastructure takes a modern software-defined approach to data center imp... » read more

Making Chip Packaging Simpler
By Ed Sperling and Mark LaPedus - 21 Mar, 2019 - Comments: 1

Packaging is emerging as one of the most critical elements in semiconductor design, but it's also proving difficult to master both technically and economically. The original role of packaging was simply to protect the chips inside, and there are still packages that do just that. But at advanced nodes, and with the integration of heterogeneous components built using different manufacturing pr... » read more

Isambard Analysis of HPC-Optimized Arm Processors
By Arm - 13 Mar, 2019 - Comments: 0

Written by Simon McIntosh‐Smith, James Price, Tom Deakin, Andrei Poenaru (all from the High Performance Computing Research Group, Department of Computer Science, University of Bristol, Bristol, UK) In this paper, we present performance results from Isambard, the first production supercomputer to be based on Arm CPUs that have been optimized specifically for HPC. Isambard is the first Cray ... » read more

Domain Expertise Becoming Essential For Analytics
By Ed Sperling - 12 Mar, 2019 - Comments: 0

Sensors are being added into everything, from end devices to the equipment used to make those sensors, but the data being generated has limited or no value unless it's accompanied by domain expertise. There are two main problems. One is how and where to process the vast amount of data being generated. Chip and system architectures are being revamped to pre-process more of that data closer to... » read more

Making Things Simple With NVMe/TCP
By Nishant Lodha - 07 Mar, 2019 - Comments: 0

Whether it is the aesthetics of the iPhone or a work of art like Monet’s ‘Water Lillies’, simplicity is often a very attractive trait. I hear this resonate in everyday examples from my own life – with my boss at work, whose mantra is “make it simple,” and my wife of 15 years telling my teenage daughter “beauty lies in simplicity.” For the record, both of these statements general... » read more

Week in Review: Design, Low Power
By SE Staff - 08 Feb, 2019 - Comments: 0

The U.S. Department of Energy (DOE) has awarded $35 million for 12 projects involving ultra-efficient power management. Called Arpa-E, the program encouraged participants to use medium-voltage electricity in new ways with real-world applications, such as industry, transportation and the grid. The top two award winners were Eaton Corp. (Arden, NC) for its DC wide-bandgap static circuit breaker, ... » read more

Making Autonomous Vehicles Safer
By Kevin Fogarty - 10 Jan, 2019 - Comments: 2

While self-driving vehicles are beta-tested on some public roads in real traffic situations, the semiconductor and automotive industries are still getting a grip on how to test and verify that vehicle electronics systems work as expected. Testing can be high stakes, especially when done in public. Some of the predictions about how humans will interact with autonomous vehicles (AVs) on public... » read more

Reducing Advanced Packaging Costs
By Ed Sperling - 09 Jan, 2019 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Where Advanced Packaging Makes Sense
By Ed Sperling - 10 Dec, 2018 - Comments: 0

Semiconductor Engineering sat down with Chenglin Liu, director of package engineering at Marvell; John Hunt, senior director of engineering at ASE; Eric Tosaya, senior director of package manufacturing at eSilicon; and Juan Rey, vice president of engineering for Calibre at Mentor, a Siemens Business. What follows are excerpts of that discussion, which was held in front of a live audience at MEP... » read more

Affordable Design With Wireless Microcontrollers
By Sree Durbha - 06 Dec, 2018 - Comments: 0

Today, we are at the peak of technology product availability with the releases of the new iPhone models, Alexa-enabled devices, and more. In the coming days, there will be numerous international consumer OEMs preparing new offerings as we approach the holiday selling season. Along with the smartphones, voice assistant enabled smart speakers and deep learning wireless security cameras, many devi... » read more

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