Bringing Curvilinear Data To Mask Data Prep

By Al Blais - 15 Aug, 2024 - Comments: 0

Advanced nodes that have been leveraging curvilinear correction with technologies such as ILT and curvilinear OPC are increasingly requiring the use of curvilinear masks to meet advanced feature size and pitch requirements. However, building curvilinear masks with standard OASIS file formats can come at the cost of large file sizes, increased turnaround time, and reduced quality of results. The... » read more

Can Mask Data Prep Tools Manage Data Glut?

By Ann Mutschler - 15 Aug, 2013 - Comments: 0

By Ann Steffora Mutschler The trend to reduce critical dimension sizes has in turn increased design file sizes, especially with the addition of optical proximity correction (OPC) steps. This extra data translates to a bigger burden to be processed downstream in the flow on the way to the mask writer. At 28nm, design post-OPC data files sizes reach hundreds of gigabytes. With 20nm and below ... » read more

Mask Data Preparation Flow For Advanced Technology Nodes

By Various Writers - 18 Apr, 2013 - Comments: 0

The trend to reduce critical features dimension has dramatically increased design file size. Design tape–out flows at the 28 nm technology node handle post-OPC data files that reach hundreds of gigabytes. This trend increases at 20 nm and below. That predicts new challenges in mask data preparation flow for advanced technology nodes. We have developed a mask data preparation flow to tackle th... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: mask data

Bringing Curvilinear Data To Mask Data Prep

Can Mask Data Prep Tools Manage Data Glut?

Mask Data Preparation Flow For Advanced Technology Nodes

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Metrology Advances Step Up To Sub-2nm Device Node Needs

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Startup Funding: Q3 2024

Knowledge Centers
Entities, people and technologies explored