Paving The Way For Sustainable AI

By Infineon - 10 Oct, 2024 - Comments: 0

Real-time requirements and the need for power-efficiency, security and privacy drives AI-processing at the edge. Key benefits of Edge AI include: -Low latency and real-time response -High power efficiency -Improved security and data privacy -Reduced cost A complementary set of AI-specific products and solutions, an end-to-end ML platform as well as an extensive application kno... » read more

Why Connectivity Is Changing Microcontrollers

By Ed Sperling - 22 Aug, 2024 - Comments: 0

More devices are being connected to the internet and to each other, transforming what used to be a simple microprocessor with fixed memory and limited connectivity into a much more complex and versatile device. These new MCUs need more compute power, more memory both on and off-chip, and on-the-fly encryption/decryption. Sivaram Trikutam, vice president of the Wi-Fi product line at Infineon, ta... » read more

MCU Changes At The Edge

By Ed Sperling - 03 Jun, 2024 - Comments: 0

Microcontrollers are becoming a key platform for processing machine learning at the edge due to two significant changes. First, they now can include multiple cores, including some for high performance and others for low power, as well as other specialized processing elements such as neural network accelerators. Second, machine learning algorithms have been pruned to the point where inferencing ... » read more

A Formal Verification Method To Detect Timing Side Channels In MCU SoCs

By Technical Paper Link - 11 Oct, 2023 - Comments: 0

A technical paper titled “A New Security Threat in MCUs – SoC-wide timing side channels and how to find them” was published by researchers at University of Kaiserslautern-Landau and Stanford University. Abstract: "Microarchitectural timing side channels have been thoroughly investigated as a security threat in hardware designs featuring shared buffers (e.g., caches) and/or parallelism b... » read more

Solving Problems With The IoT

By John Koon - 02 Feb, 2023 - Comments: 0

The Internet of Things, a term once applied to almost any "smart" gadget connected to the Internet, is becoming more useful, more complex, and more of a security risk as the value of data continues to grow and more people depend on IoT technology. In the decades since the concept was first introduced, IoT devices have become so ubiquitous that applications cover practically every consumer, c... » read more

Put A Data Center In Your Phone!

By Andy Jaros - 10 Oct, 2022 - Comments: 0

Datacenters heavily leverage FPGAs for AI acceleration. Why not do the same for low power edge applications with embedded FPGA (eFPGA)? It’s common knowledge for anyone connected to the cloud computing industry that data centers heavily rely on FPGAs for programmable accelerators enabling high performance computing for AI training and inferencing. These heterogeneous computing solution... » read more

Repositioning For A Changing IC Market

By Ed Sperling - 26 May, 2022 - Comments: 0

Sailesh Chittipeddi, executive vice president at Renesas, sat down with Semiconductor Engineering to talk about how changes in end markets are shifting demand for technology. What follows are excerpts of that conversation. SE: Renesas has acquired a number of companies over the past several years. What's the goal? Chittipeddi: The goal very simply is to create an industry leading solutio... » read more

200mm Shortages May Persist For Years

By Mark LaPedus - 20 Jan, 2022 - Comments: 2

A surge in demand for chips at more mature process nodes is causing shortages for both 200mm foundry capacity and 200mm equipment, and it shows no signs of letting up. In fact, even with new capacity coming on line this year, shortages are likely to persist for years, driving up prices and forcing significant changes across the semiconductor supply chain. Shortages for both 200mm foundry cap... » read more

End In Sight For Chip Shortages?

By Mark LaPedus - 18 Nov, 2021 - Comments: 2

The current wave of semiconductor and IC packaging shortages is expected to extend well into 2022, but there are also signs that supply may finally catch up with demand. The same is true for manufacturing capacity, materials and equipment in both the semiconductor and packaging sectors. Nonetheless, after a period of shortages in all segments, the current school of thought is that chip suppl... » read more

How To Reduce The Impact Of The Global Microcontroller Shortage On ECU Software Development

By Siemens EDA - 03 Nov, 2021 - Comments: 0

The COVID-19 pandemic had a massive impact on all facets of business and commerce, as widespread supply chain disruptions rippled through every industry. Multiple factors collided to create a global microcontroller shortage that is now impacting the automotive industry, and is forcing developers to redesign Electronic Control Units (ECUs) using alternative Microcontrollers (MCUs) and to otherwi... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?