A New Approach For Sensor Design

By Karen Heyman - 28 Dec, 2023 - Comments: 0

Pawel Malinowski, program manager at imec, sat down with Semiconductor Engineering to discuss what's changing in sensor technology and why. What follows are excerpts of that discussion. SE: What's next for sensor technology? Malinowski: We are trying to find a new way of making image sensors because we want to get out of the limitations of silicon photodiodes. Silicon is a perfect materi... » read more

Developing A Customized RISC-V Core For MEMS Sensors

By Tora Fridholm - 22 Jun, 2023 - Comments: 0

We recently described how Codasip Labs is working with the NimbleAI project to push the boundaries of neuromorphic vision. Let’s talk about another cool project. This project is focused on another sense, hearing. We will use our unique Codasip Studio design toolset to develop a customized RISC-V core for MEMS (micro-electro-mechanical system) sensors. Again, technology is inspired by bio... » read more

Nanophotonic Sensor Implants With 3D Hybrid Periodic-Amorphous Photonic Crystals For Wide-Angle Monitoring Of Long-Term In-Vivo Intraocular Pressure

By Samsung - 19 Apr, 2023 - Comments: 0

In this work, we have developed a nanophotonic-based optomechnical device and reported the smallest intraocular pressure (IOP) implant (Dia: 500 um, Thick: 200 um) that can be placed in any area under the cornea into the anterior chamber without touching the endothelium. The sensor is made of only flexible biocompatible silicone/polydimethylsiloxane (PDMS) and structured as 3D hybrid photonic c... » read more

Heterogeneous Integration: Fertile Ground For Medical And Biotech Innovation

By Promex Industries - 18 Jan, 2023 - Comments: 0

Sensing components in medical and biotech devices often place severe restrictions on the assembly methods that can be employed, which is part of what is driving heightened demand for heterogeneous integration (HI). It is the newest frontier for the medical and biotech manufacturing services industry to contribute our own innovations by developing the processes to build these unique combinations... » read more

Heterogeneous Assembly Datasheet

By Promex Industries - 16 Dec, 2022 - Comments: 0

Medical and biotech devices often include optical, chemical, RF, and liquid elements. Some are combined with electronic devices to increase functionality or interaction with the environment. To produce these devices, multiple technologies are combined in a cost-effective way, ideally using a rapid process development cycle to minimize time to market. Combining technologies, as well as combining... » read more

Heterogeneous Assembly

By Promex Industries - 16 Nov, 2022 - Comments: 0

Design And Security Challenges for VR

By John Koon - 10 Aug, 2022 - Comments: 0

Virtual reality is no longer just for gamers, and as this technology is deployed in everything from health care to industrial training, the requirements for processing more data faster over a high-speed connection are growing. Designing these devices continues to be a study in contradictions. They must be extremely low power, with a small enough batteries to make them comfortable to wear. Bu... » read more

Telecare Challenges: Secure, Reliable, Lower Power

By John Koon - 20 Jul, 2022 - Comments: 0

The adoption of telecare using a variety of connected digital devices is opening the door to much more rapid response to medical emergencies, as well as more consistent monitoring, but it also is adding new challenges involving connectivity, security, and power consumption. Telecare has been on the horizon for the better part of two decades, but it really began ramping with improvements in s... » read more

What Will Be The Killer App For 5G? Time To Place Your Bets

By Panch Chandrasekaran - 10 Feb, 2022 - Comments: 0

5G is here. But where will its capabilities soar first? Here are my guesses for where the breakthroughs could occur along with factors that might hold it back. 1. Supply Chain. The world’s 5,300+ plus cargo ships carry 90% of the world’s freight and can collectively hold 1.97 billion deadweight tons of cargo. 5G—delivered through private networks or secure slices of public networks—c... » read more

Health Care Is Gold Mine For Hackers

By John Koon - 24 Jan, 2022 - Comments: 0

Today’s digital health care systems are facing relentless cyberattacks, which are targeting health care organizations as well as the medical devices they use. The critical nature and size of the U.S. health care market — an estimated $3.5 trillion in 2020, with substantial growth anticipated — make it a favorite target of hackers. Vanson Bourne conducted a survey for Sophos in early 20... » read more

← Older posts

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?