System Bits: Sept. 11


Everything’s faster in Texas The Frontera supercomputing system was formally unveiled last week at the Texas Advanced Computing Center. The system was deployed in June on the University of Texas at Austin campus. It is the fifth-fastest supercomputer in the world at present and the world's fastest academic supercomputer. Dell EMC and Intel collaborated on fitting out Frontera. Work beg... » read more

Week in Review: IoT, Security, Autos


Products/Services Rambus reports completing its acquisition of Northwest Logic, a supplier of memory, PCIe, and MIPI digital controllers. Meanwhile, the company named Sean Fan as chief operating officer. He previously served as vice president and general manager of the data center business unit at Renesas Electronics. Prior to its acquisition by Renesas earlier this year, Fan held senior execu... » read more

Nvidia to Buy Mellanox for $6.9B


Nvidia reached a definitive agreement to acquire Mellanox Technologies for $125 a share in cash, giving the deal an enterprise value of about $6.9 billion. The proposed transaction would complement Nvidia’s product portfolio in high-performance computing for applications in artificial intelligence and big data analytics, with Mellanox’s specialty in providing interconnects for hyperscale da... » read more

Week In Review: Design, Low Power


Tools & Standards Mentor uncorked a PCB design platform for non-specialist PCB engineers focused on multi-dimensional verification. The Xpedition platform can integrate a range of verification tools within a singular authoring environment, providing automatic model creation, concurrent simulation, cross probing from results, and error reviews to identify problems at the schematic or layout... » read more

The Week In Review: Design/IoT


Tools Aldec updated its emulation and simulation acceleration software package for high speed prototyping boards, adding a SCE-MI Pipes-based flow for streaming large amounts of data, and a 30% speed increase for all emulation modes. Plus, Aldec's mixed-language FPGA design and simulation platform now includes a complete coverage analysis package for FPGA and ASIC designers with the addition... » read more

The Week In Review: Design/IoT


Tools Cadence updated its Allegro PCB product line with a new manufacturing option that accelerates manufacturing documentation and technology updates for increased efficiency, control and productivity for designers and streamlining handoff to manufacturing. The release also allows users to develop custom fabrication and assembly rules. Invionics expanded its Invio EDA development platfor... » read more

The Week In Review: Design


Tools CEVA integrated Bluetooth processing into its DSP cores. In addition to audio and video and always-on capabilities, the company is pitching the combination as an all-in-one, ultra-low-power solution for the wearable electronics market. So how big is this market opportunity? IDC predicts the wearable computing market will grow from 19.2 million units this year to 112 million units in 2... » read more

The Week In Review: Sept. 3


By Mark LaPedus The cellular chip supplier landscape is littered with corpses. So will 4G lead to the destruction of Qualcomm and Intel? That’s highly unlikely, according to a blog from Strategy Analytics. “With the recent announcement of a multimode LTE chipset from Intel, it seems likely that Qualcomm and Intel will maintain their status as the top two cellular radio chipset suppliers in... » read more

The Week In Review: Aug. 30


By Ann Steffora Mutschler Continuing its drive towards enabling the Internet of Things (IoT), Renesas recently licensed a third Tensilica core from Cadence, this time the ConnX D2 DSP, which has acceleration packages optimized for IoT wired and wireless modem standards. Renesas previously licensed the Tensilica HiFi Audio DSP and ConnX BBE16 cores. In another deal for Cadence, Mellanox Tech... » read more