tag: Mentor

Advanced Packaging Drives Test And Metrology Innovations
By Gregory Haley - 12 Nov, 2024 - Comments: 0

Advanced packaging has become a focal point for innovation as the semiconductor industry continues to push for increased transistor density and better performance. But the pace of change is accelerating, making it harder for the entire ecosystem to keep up with those changes. In the past, major developments were roughly on an 18-month to 2-year cadence. Today, this is happening every few mon... » read more

Yield Management Embraces Expanding Role
By Laura Peters - 12 Nov, 2024 - Comments: 0

Competitive pressures, shrinking time-to-market windows, and increased customization are collectively changing the dynamics and demands for yield management systems, shifting left from the fab to the design flow and right to assembly, packaging, and in-field analysis. The basic role of yield management systems is still expediting new product introductions, reducing scrap, and delivering grea... » read more

Chip Industry Week In Review
By The SE Staff - 08 Nov, 2024 - Comments: 0

Analog Devices acquired Flex Logix's technology assets, along with its technical team. Semiconductor global sales increased 23% in Q3 2024 $166B, up almost 11% versus the same period in 2023, according to SIA. Notable regional year-to-year sales in September: Americas up 46%, China up 23%, Europe down 8%. Fig.1: Worldwide Semiconductor Revenues, year-to-year % change. Source: Semiconduc... » read more

Preparing For The Multiphysics Future Of 3D ICs
By Siemens EDA - 07 Nov, 2024 - Comments: 0

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

Reliability On The Road: Multiphysics Design For Automotive 3D-ICs
By John Ferguson - 07 Nov, 2024 - Comments: 0

Anyone who has purchased a car over the past decade knows that there has been a huge increase in the amount of compute processing involved in today’s modern automotive industry. Advanced chips for diagnostics and entertainment as well as logic associated with advanced sensor technology and automated assist features have quickly become key requirements that drivers rely on every day to ensure ... » read more

Automotive OEMs Focus On SDVs, Zonal Architectures
By Ann Mutschler - 07 Nov, 2024 - Comments: 0

Giant automotive OEMs are re-evaluating how quickly to move to advanced technologies and software-driven designs amid crushing financial pressure from low-cost EVs developed in other markets such as China. U.S., European, and Japanese OEMs have been struggling for the past half-decade or so to figure out which is the best approach to developing EVs, undergoing multiple shifts in both hardwar... » read more

AI Drives IC Design Shifts At The Edge
By Adam Kovac and Ed Sperling - 07 Nov, 2024 - Comments: 0

The increasing adoption of AI in edge devices, coupled with a growing demand for new features, is forcing chipmakers to rethink when and where data gets processed, what kind of processors to use, and how to build enough flexibility into systems to span multiple markets. Unlike in the cloud, where the solution generally involves nearly unlimited resources, computing at the edge has sharp cons... » read more

Batteries Look Beyond Lithium
By Bryon Moyer - 07 Nov, 2024 - Comments: 1

Lithium batteries dominate today’s rechargeable battery market, and while they have been wildly successful, challenges with lithium have spurred research into alternative chemistries that can improve on some of lithium’s downsides and still keep as many of the upsides as possible. So far, none of the alternative batteries has seen commercial success, but several variants have moved beyon... » read more

Big Changes Ahead For Analog Design
By Ed Sperling - 06 Nov, 2024 - Comments: 1

Experts at the Table: Semiconductor Engineering sat down to discuss the impact of heterogeneous integration on in-house analog tools, and how that is changing the design process, with Mo Faisal, president and CEO of Movellus; Hany Elhak, executive director of product management at Synopsys; Cedric Pujol, product manager at Keysight; and Pradeep Thiagarajan, principal product manager for custom ... » read more

Blog Review: Nov. 6
By Jesse Allen - 06 Nov, 2024 - Comments: 0

Cadence's Satish Kumar C explores how the Deferrable Memory Write transaction type in PCIe and CXL can improve latency, efficiency, and performance by delaying certain memory write operations during system bus congestion or until other priority tasks are complete and highlights implementation and verification challenges. Synopsys' Daryl Seitzer and Rahul Thukral point to magnetoresistive RAM... » read more

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