tag: Mentor Graphics

How To Build Security Into Your IoT Wearable Device
By Mentor, a Siemens Business - 05 Jan, 2017 - Comments: 0

In today's connected world, IoT wearable devices should be built from the ground up to include basic, fundamental security capabilities. This whitepaper explains the key security technologies critical for creating a secure IoT embedded device. Topics include code and boot-time authentication, establishing a chain of trust, process separation and space partitioning, using a safety-certified oper... » read more

Prioritizing Vehicle Data Traffic
By Ann Mutschler - 05 Jan, 2017 - Comments: 1

It’s no surprise to hear that data complexity is on the rise inside vehicles today, but the scale just might cause you to gag on your coffee. It's expected that a fully connected car will upload as much as 30 gigabytes of data to the cloud every hour. Given the scale of data, it is imperative to make sure every bit of it is classified and tagged properly so that the subsystems, and inf... » read more

Making Secure Chips For IoT Devices
By Jeff Dorsch - 05 Jan, 2017 - Comments: 1

Chips and modules going into Internet of Things node devices must have cybersecurity features designed and built into them. Multiple vendors are responding with products meant to keep the IoT devices protected from the cyberattacks that are becoming more common. While [getkc id="76" kc_name="IoT"] privacy remains a key concern for consumers and homeowners, IoT security has taken on top-of-mi... » read more

Automotive Technology Trends Reshaping An Industry
By Brian Derrick - 05 Jan, 2017 - Comments: 0

The automotive industry is being disrupted as never before in its history. Casual observers might think this disruption is only about the march toward self-driving cars, which has captured a majority share of the headlines and online chatter. Autonomy is a huge development, to be sure, but two other major technology trends, electrification and connectivity, need equal air time. More than a y... » read more

Blog Review: Jan. 4
By Jesse Allen - 04 Jan, 2017 - Comments: 0

Mentor's Harry Foster wraps up his functional verification study series with a look the impact of verification maturity and safety critical designs on first silicon success. Synopsys' David Benas argues for using the insurance industry as a model in assessing the risk of potential software flaws. Cadence's Tom Anderson shares highlights from the recent International Workshop on Microproce... » read more

Architect Specs Harder To Follow
By Ann Mutschler - 28 Dec, 2016 - Comments: 0

Interpreting and implementing architects' specifications is getting harder at each new process node, which is creating problems throughout the design flow, into manufacturing, and sometimes even post-production. Rising complexity and difficulties in scaling have pushed much more of the burden onto architects to deal with everything from complex power schemes, new packaging approaches, and to... » read more

Transistor-Level Defect Diagnosis
By Geir Eide - 22 Dec, 2016 - Comments: 0

Each new semiconductor process node represents exciting opportunities for suppliers of design, manufacturing, test, and failure analysis solutions. A new process means new challenges to solve, and hopefully more money to be made. On the flip side, whenever solutions that address these new challenges are presented, we seldom hear how useful these are to more mature process nodes. One technology ... » read more

CEO Outlook: Chip Design 2017
By Ed Sperling - 22 Dec, 2016 - Comments: 0

After two consecutive flat to slightly down years, the semiconductor industry is poised for growth in 2017. Cowan this month predicted 4.7% growth in semiconductor sales in 2017, while World Semiconductor Trade Statistics (WSTS) put that figure at 3.3%. And last month, International Business Strategies (IBS) pegged the number at 4.6%, according to statistics compiled by the Global Semiconduc... » read more

What’s Missing In Advanced Packaging
By Ann Mutschler - 22 Dec, 2016 - Comments: 0

Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

Tools For Heterogeneous System Development
By Brian Bailey - 22 Dec, 2016 - Comments: 1

System architects look to both heterogeneous and homogeneous computing when there are no other options available, but the current thinking is that a system-level software methodology could simplify the design, ease integration of various blocks, and potentially improve performance for less power. While the theory appears sound enough, implementing it has turned out to be harder than expected. ... » read more

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