tag: Mentor

RISC-V Heralds New Era Of Cooperation
By Brian Bailey - 30 May, 2024 - Comments: 0

RISC-V is paving the way for open source to become accepted within the hardware community, creating a level of industry collaboration never seen in the past, while revitalizing the connection between academia and industry. The big question is whether this arrangement is just a placeholder while the industry re-learns how to develop processors, or whether this processor architecture is someth... » read more

AI For Data Management
By Adam Kovac - 30 May, 2024 - Comments: 0

Data management is becoming a significant new challenge for the chip industry, as well as a brand new opportunity, as the amount of data collected at every step of design through manufacturing continues to grow. Exacerbating the problem is the rising complexity of designs, many of which are highly customized and domain-specific at the leading edge, as well as increasing demands for reliabili... » read more

Trouble Ahead For IC Verification
By Brian Bailey - 30 May, 2024 - Comments: 0

Verification complexity is roughly the square of design complexity, but until recently verification success rates have remained fairly consistent. That's beginning to change. There are troubling signs that verification is collapsing under the load. The first-time success rate fell (see figure 1) in the last survey conducted by Wilson Research, on behalf of Siemens EDA, in 2022. A new survey ... » read more

Distribution of Currents In Via Arrays
By Siemens EDA - 29 May, 2024 - Comments: 0

It has become increasingly difficult in recent years to provide adequate PDNs on a PCB. The sheer number of different voltages, combined with increased current demands, makes distributing current around the board a substantial layout challenge. This paper demonstrates that by using appropriate and accurate simulations, combined with the improved intuition that such simulations bring, it is a ch... » read more

Chip Industry Week In Review
By The SE Staff - 24 May, 2024 - Comments: 0

Absolics, an affiliate of Korea materials company SKC, will receive up to $75 million in direct funding under the U.S. CHIPS Act for the construction of a 120,000 square-foot facility in Covington, Georgia, for glass substrates in advanced packaging. imec will host a €2.5 billion (~$2.72B) pilot line for researching chips beyond 2nm, partially funded through the EU Chips Act. imec CEO Luc ... » read more

A Wrap-Up Of Photomask Japan 2024
By Ingo Bork - 23 May, 2024 - Comments: 0

This year, I had the opportunity to attend the 30th Symposium on Photomask and NGL Mask Technology, also called Photomask Japan 2024 (PMJ), in Yokohama, Japan, from April 16 to 18. This well-regarded symposium brings together engineers from all over the world to share ideas on photomasks, NGL masks and related technologies. It was great being back to an in-person conference after four years ... » read more

Electromigration And IR Drop At Advanced Nodes
By Ed Sperling - 22 May, 2024 - Comments: 0

Manufacturing chips at 3nm and below is a challenge, but it's only part of the problem. Designing chips that can be manufactured and will actually work is potentially an even bigger problem. There is more data to sift through for place-and-route, less margin to pad a design, and there are more physical effects to contend with as transistors get taller, density increases, and chips age. Jeff Wil... » read more

Blog Review: May 22
By Jesse Allen - 22 May, 2024 - Comments: 0

Cadence's Sree Parvathy introduces Verilog-A, a high-level language that uses modules to describe the structure and behavior of analog systems and enables the top-down system to be defined before the actual transistor circuits are assembled. Siemens' Keith Felton suggests the process of package substrate design is improved by leveraging the collective expertise of multiple design domain spec... » read more

High-Level Synthesis Propels Next-Gen AI Accelerators
By Russell Klein - 20 May, 2024 - Comments: 0

Everything around you is getting smarter. Artificial intelligence is not just a data center application but will be deployed in all kinds of embedded systems that we interact with daily. We expect to talk to and gesture at them. We expect them to recognize and understand us. And we expect them to operate with just a little bit of common sense. This intelligence is making these systems not just ... » read more

Chip Aging Becoming Key Factor In Data Center Economics
By Ann Mutschler - 20 May, 2024 - Comments: 1

Chip aging is becoming a much bigger concern inside of data centers, where it can impact server uptime, utilization rates, and the amount of energy needed to drive signals and cool entire server racks. Aging in chips is the result of both higher logic utilization and increasing transistor density. This is problematic for data centers, in general, but especially for AI chips where digital log... » read more

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