EDA Back On Investors’ Radar

By Brian Bailey - 25 Jan, 2024 - Comments: 0

EDA is transforming from a staid but strategic sector into a hot investment market, fueled by strong earnings and growth, a clamoring for leading-edge and increasingly customized designs across new and existing markets, and the rollout of advanced technologies such as AI for a range of tools that will be needed to develop new architectures with much greater performance per watt. A confluence... » read more

IC Tool Vendors Eye Cloud-Native Future

By Aharon Etengoff - 25 Jan, 2024 - Comments: 0

The promise of scalability and efficiency is accelerating the migration of electronic design automation (EDA) to the cloud. Unlimited on-demand compute resources fundamentally change the chip design paradigm, where tools and workloads are no longer constrained by localized hardware. This is easier said than done, however. Optimizing existing tools and infrastructure, creating a new generatio... » read more

Five Digital Threads Unify And Simplify Electronic Systems Design And Manufacturing

By Matt Walsh - 25 Jan, 2024 - Comments: 0

By Matthew Walsh and Matt Bromley Digital transformation involves the integration of digital technologies and the reimagining of business processes to enhance operations, improve customer experiences, and drive innovation. Digital threads are a key component of this transformation, as they enable the seamless flow of data and information across various stages of a process, system, or organiz... » read more

Shifting Left Using Model-Based Engineering

By Karen Heyman - 25 Jan, 2024 - Comments: 0

As heterogenous integration increases design complexity and forces engineers out of long-standing silos, model-based systems engineering (MBSE) is becoming essential for improving quality and reducing failures in the field. While it may seem like a new buzzword, MBSE's principles date back to the 1990s. In essence, it's a process of building models that enable early decisions, which pays off... » read more

Mastering Complexity Leveraging Digital Threads For Electronics Systems Design And Manufacturing

By Siemens EDA - 25 Jan, 2024 - Comments: 0

The rapid advancement of technology and its integration into various industries, particularly the electronics sector, has led to a significant increase in complexity. Digital threads offer a seamless framework for data flow throughout a product’s lifecycle, from ideation to utilization, fostering collaboration and informed decision-making. They intersect various domains, ensuring information ... » read more

Blog Review: Jan. 24

By Jesse Allen - 24 Jan, 2024 - Comments: 0

Siemens' John McMillan finds that while 3D-IC capabilities are ready for mainstream, mass adoption success depends on how easily, effectively, and efficiently a solution can be delivered and points to five workflow adoption focus areas. Cadence's Andre Baguenie shows how to easily convert a logic signal to an electrical value using Verilog-AMS and the transition filter. Synopsys' Chris Cl... » read more

Rethinking Memory

By Karen Heyman - 22 Jan, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the path forward for memory in increasingly heterogeneous systems, with Frank Ferro, group director, product management at Cadence; Steven Woo, fellow and distinguished inventor at Rambus; Jongsin Yun, memory technologist at Siemens EDA; Randy White, memory solutions program manager at Keysight; and Frank Schirrmeister, vice... » read more

Chip Industry Week In Review

By The SE Staff - 19 Jan, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Blog Review: Jan. 17

By Jesse Allen - 17 Jan, 2024 - Comments: 0

Cadence's Rajneesh Chauhan introduces the Back-Invalidate feature in Compute Express Link (CXL) 3.0 and how it contributes to the efficient functioning of modern data center architectures by upholding cache coherence across multiple hosts and devices. Synopsys' Brett Murdock and Dana Neustadter point out the importance of protecting against DRAM attacks such as Rowhammer, RAMbleed, and cold-... » read more

Which Data Works Best For Voltage Droop Simulation

By Ann Mutschler - 15 Jan, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the need for the right type of data, why this has to be done early in the design flow, and how 3D-IC will affect all of this, with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight; Venkatesh Santhanagopalan, prod... » read more

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Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Mentor

EDA Back On Investors’ Radar

IC Tool Vendors Eye Cloud-Native Future

Five Digital Threads Unify And Simplify Electronic Systems Design And Manufacturing

Shifting Left Using Model-Based Engineering

Mastering Complexity Leveraging Digital Threads For Electronics Systems Design And Manufacturing

Blog Review: Jan. 24

Rethinking Memory

Chip Industry Week In Review

Blog Review: Jan. 17

Which Data Works Best For Voltage Droop Simulation

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Knowledge Centers
Entities, people and technologies explored