tag: Mentor

Successful 3D-IC Design, Verification, And Analysis Requires An Integrated Approach
By Siemens EDA - 30 Nov, 2023 - Comments: 0

3D-IC designs enable improvements in performance, power, footprint, and costs that cannot be attained in system-on-chip (SoC) and IC design. However, the leap from traditional SoC/IC design to 3D-IC designs brings not only new opportunities, but also new challenges. Siemens EDA provides multiple 3D-IC design analysis and verification functionalities that address the diverse needs of 3DIC des... » read more

Making Heterogeneous Integration More Predictable
By Ed Sperling - 29 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

Blog Review: November 29
By Jesse Allen - 29 Nov, 2023 - Comments: 0

Siemens' Matt Walsh checks out electro-thermal design and how a Boundary Condition Independent Reduced Order Model (BCI-ROM) can capture accurate characteristics from a 3D thermal analysis, ready for use in a 1D circuit simulation. Cadence's Vinod Khera considers how EDA could benefit from the AI revolution by providing a productivity boost through virtual assistants and improving code quali... » read more

Autonomous Vehicles: Not Ready Yet
By John Koon - 27 Nov, 2023 - Comments: 0

The swirl of activity around L4 and L5 vehicles has yet to result in a successful demonstration of an autonomous vehicle that can navigate the streets of a city or highway without incident, and there is a growing body of real-world data showing that much work still needs to be done. Robo-taxi trials in big cities such as San Francisco, Los Angeles, and soon San Diego, are proving that autono... » read more

Chip Industry Week In Review
By The SE Staff - 22 Nov, 2023 - Comments: 0

By Jesse Allen, Susan Rambo, and Liz Allan The U.S. government will invest about $3 billion for the National Advanced Packaging Manufacturing Program (NAPMP), including an advanced packaging piloting facility to help U.S. manufacturers adopt new technology and workforce training programs. It also will provide funding for projects concentrating on materials and substrates; equipment, tools, ... » read more

Chip Industry Week In Review
By The SE Staff - 17 Nov, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Japan's Rapidus and the University of Tokyo are teaming up with France's Leti to meet its previously announced mass production goal of 2nm chips by 2027, and chips in the 1nm range in the 2030s. Rapidus was formed in 2022 with the support of eight Japanese companies — Sony, Kioxia, Denso, NEC, NTT, SoftBank, Toyota, and Mitsubishi's banking arm, ... » read more

Blog Review: November 15
By Jesse Allen - 15 Nov, 2023 - Comments: 0

Cadence's Neelabh Singh explores the process of lane initialization and link training in bringing up a high-speed link in USB4. Synopsys' Shela Aboud argues that TCAD should be an integral part of an EDA flow as it enhances design technology co-optimization with a way to experiment and determine what works and what doesn’t work at different process nodes using physics-based models. Siem... » read more

What Can Go Wrong In Heterogeneous Integration
By Ed Sperling - 15 Nov, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom IC & PCB Group; and Tony Mastroia... » read more

DRAM Choices Are Suddenly Much More Complicated
By Ed Sperling - 13 Nov, 2023 - Comments: 0

Chipmakers are beginning to incorporate multiple types and flavors of DRAM in the same advanced package, setting the stage for increasingly distributed memory but significantly more complex designs. Despite years of predictions that DRAM would be replaced by other types of memory, it remains an essential component in nearly all computing. Rather than fading away, its footprint is increasing,... » read more

Chip Industry Week In Review
By The SE Staff - 10 Nov, 2023 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Bosch, Infineon, and NXP were cleared in Germany to each acquire 10% of the European Semiconductor Manufacturing Co. (ESMC), established by TSMC, solidifying the supply chain against future shortages, particularly for automotive chips. “ESMC intends to build and operate another large semiconductor factory in Dresden, in which the three Europ... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy