When It Makes Sense To Perform An Open Source Audit

By Synopsys - 02 Jun, 2021 - Comments: 0

Today's software is not created so much as assembled. The parts that serve as ingredients come from a variety of sources, but mostly from the millions of open source components freely available on the internet. This has enabled a digital transformation in several industries, helping market leaders speed their time to market, lower costs, and improve innovation. But what are the licensing and... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 12 Jul, 2019 - Comments: 0

Products/Services Arteris IP reports that Bitmain licensed the Arteris Ncore Cache Coherent Interconnect intellectual property for use in its next-generation Sophon Tensor Processing Unit system-on-a-chip devices for the scalable hardware acceleration of artificial intelligence and machine learning algorithms. “Our choice of interconnect IP became more important as we continued to increase t... » read more

Week in Review – IoT, Security, Auto

By Jeff Dorsch - 05 Jul, 2019 - Comments: 0

Products/Services Synopsys announced successful deployment of the Synopsys Yield Explorer yield learning platform for fast ramp-up of new products on Samsung's advanced finFET technology nodes. Using the secure data exchange mechanism in Yield Explorer, Samsung is able to share the data required for yield analysis, such as chip design, fab, and test, with its customers while maintaining the co... » read more

HPE to Buy Cray in $1.3B Deal

By Jeff Dorsch - 17 May, 2019 - Comments: 0

Hewlett Packard Enterprise agreed to acquire Cray Inc. for $35 a share in cash, with the transaction valued at about $1.3 billion, net of cash. The proposed merger would add supercomputing system technology to HPE’s product portfolio, expanding its offerings in high-performance computing (HPC). The HPC segment of the IT market, together with the associated data storage and services, is for... » read more

Lam To Acquire KLA-Tencor

By Mark LaPedus - 21 Oct, 2015 - Comments: 1

In a major and surprising move in the fab tool business, Lam Research has entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion in cash and stock. Lam’s proposed move to acquire KLA-Tencor would create a powerhouse in the fab tool industry. The combined company will have approximately $8.7 billion in annual revenue, propelling it to become the world’s second l... » read more

An Acquisition And A Merged Technology Strategy

By Kenji Tsuda - 29 Jul, 2014 - Comments: 0

A single chip capable of performing two different functions can reduce the amount of wiring needed to just one layer and it can reduce time to market by simplifying the supply chain and the planning process. Nowhere is this more evident than in the LCD chip market, where two different manufacturers were used to supply chips for touch panels. But an effort to consolidate them into a single ch... » read more

Buying And Selling EDA Companies

By Ed Sperling - 22 Aug, 2013 - Comments: 0

By Ed Sperling The rule of thumb for mergers and acquisitions is that the majority will fail. So why, despite concerns about big companies buying up the tools of startups, does EDA’s track record look so good? There are a number of answers that are unique to the EDA industry: There is no manufacturing that needs to be absorbed by the acquirer, which greatly simplifies any deal. Sale... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer