Process Control For Next-Generation Memories


The Internet of Things (IoT), Big Data and Artificial Intelligence (AI) are driving the need for higher speeds and more power-efficient computing. The industry is responding by bringing new memory technologies to the marketplace. Three new types of memory in particular—MRAM (magnetic random access memory), PCRAM (phase change RAM) and ReRAM (resistive RAM)—are emerging as leading candidat... » read more

Smart Manufacturing Solutions: Build or Buy?


Enterprise smart manufacturing platforms have become an important part of the manufacturing ecosystem, especially in domains such as semiconductors and electronics. McKinsey & Company estimates, for example, that the quantity of process, product, and machine data collected on a daily basis in a typical fab quickly exceeds terabytes. If you add to this in-line and end-of-line inspection as w... » read more

Advanced Process Control


David Fried, vice president of computational products at Lam Research, looks at shrinking tolerances at advanced processes, how that affects variation in semiconductor manufacturing, and what can be done to achieve the benefits of scaling without moving to new transistor architectures. » read more

Weighing Wafers Simplifies Metrology


Building semiconductors is an incredibly exacting process, with critical dimensions posing significant equipment challenges—and with the possibility that small process excursions can cause the yield to decrease. For this reason, it has always been important to measure and monitor the most critical process steps to ensure that no further processing is done on a faulty lot and so that equipment... » read more

Inspection, Metrology Challenges Grow For SiC


Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

Controlling Variability And Cost At 3nm And Beyond


Richard Gottscho, executive vice president and CTO of Lam Research, sat down with Semiconductor Engineering to talk about how to utilize more data from sensors in manufacturing equipment, the migration to new process nodes, and advancements in ALE and materials that could have a big impact on controlling costs. What follows are excerpts of that conversation. SE: As more sensors are added int... » read more

The Precision Knob


Precision used to be a goal, but increasingly it is being used as a tool. This is true for processing and algorithms, where less precision can greatly improve both performance and battery life. And it is true in manufacturing, where more precision can help minimize the growing impact of variation. Moreover, being able to dial precision up or down can help engineers see the impact on a system... » read more

3D NAND Metrology Challenges Growing


3D NAND vendors face several challenges to scale their devices to the next level, but one manufacturing technology stands out as much more difficult at each turn—metrology. Metrology, the art of measuring and characterizing structures, is used to pinpoint problems and ensure yields for all chip types. In the case of 3D NAND, the metrology tools are becoming more expensive at each iteration... » read more

Finding Defects In Chips With Machine Learning


Chipmakers are using more and different traditional tool types than ever to find killer defects in advanced chips, but they are also turning to complementary solutions like advanced forms of machine learning to help solve the problem. A subset of artificial intelligence (AI), machine learning has been used in computing and other fields for decades. In fact, early forms of machine learning ha... » read more

Manufacturing Bits: March 11


Measuring molecules The Technical University of Munich (TUM) has developed a new metrology technique that determines the properties of individual molecules. The technique, called single-molecule excitation–emission spectroscopy, improves upon the traditional methods to explore molecules. The traditional method, dubbed single-molecule spectroscopy (SMS), is not new and is used to analyze f... » read more

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