Packaging Wars Ahead


There has been much talk about semiconductor industry consolidation, but the shift into advanced packaging could have more far-reaching effects than all the mega-deals so far. Packaging is big business. Yole Développement has pinned the market at $30 billion, but that's only a thin slice of the pie that's in play. Companies that win the packaging deals also have a good shot of winning the m... » read more

ReRAM Gains Steam


Resistive RAM appears to be gaining traction. Once considered a universal memory candidate—a replacement for DRAM, flash and SRAM—ReRAM is carving out a niche between DRAM and storage-class memory. Now the question is how large that niche ultimately becomes and whether other competing technologies rush into that space. [getkc id="94" kc_name="ReRAM"] (known alternately as RRAM), is a typ... » read more

What China Is Planning


Over the years, China has unveiled several initiatives to advance its domestic semiconductor industry. China has made some progress at each turn, although every plan has fallen short of expectations. But now, the nation is embarking on several new and bold initiatives that could alter the IC landscape. China’s new initiatives address at least three key challenges for its IC industry: 1. C... » read more

Inside The MRAM


Today, the industry is shipping various next-generation nonvolatile memory types, such as 3D NAND, MRAM and ReRAM. In fact, MRAM has been shipping for some time. To get a handle on MRAM, Semiconductor Engineering sat down to discuss the technology with Phillip LoPresti, president and chief executive of Everspin, a supplier of MRAMs. What follows are excerpts of that conversation. SE: Where ... » read more

Memory Hierarchy Shakeup


It’s no secret that today’s memory chips and storage devices are struggling to keep up with the growing demands in data processing. To solve the problem, chipmakers have been working on several next-generation memory types. But most technologies have been delayed or fallen short of their promises. But after numerous delays, a new wave of next-generation, nonvolatile memories are finally ... » read more

Executive Insight: Charlie Cheng


Charlie Cheng, CEO of Kilopass, sat down with Semiconductor Engineering to talk about issues with current memory types and why the market is ready for disruptive approaches to reduce power and cost. SE: What's changing in the memory space? Cheng: Memory is a very important building block. It's a foundation and a commodity for a chip and for the system, but if you look at the big picture, ... » read more

Much Ado About Weakening Currency, China, And IoT


At the 10th annual SEMI/Gartner Market Symposium, keynoted by ARM’s Ian Ferguson, market analysts gathered to present their views on the current state of the industry. Several key themes emerged including weakening currency impact on the industry’s forecasts, China’s $20 billion Industry Fund, and the Internet of Things (IoT). Industry overview and trends were presented by Bob Johnson,... » read more

Getting Paid More


Consolidation is a regular news item in the semiconductor industry, and has been for years, but most of those deals have been relatively small. What's changing is the amount of consolidation involving big companies, fueled partly by a massive M&A fund in China, partly by an arms race in preparation for the IoE, and partly by the kind of thinking that if other companies are doing it, it's dan... » read more

The Week In Review: Design/IoT


Summit Research reports on the proposed buyout of Micron by China's Tsinghua Unigroup. New York Senator Chuck Schumer wrote a letter urging the United States to block any potential sale of the Boise memory-chip maker to the group. Summit states the Tsinghua investment is more likely to be a stake in Micron that specifically forbids certain IP to be made available in order to protect national se... » read more

The Memory And Storage Hierarchy


The memory and storage hierarchy is a useful way of thinking about computer systems, and the dizzying array of memory options available to the system designer. Many different parameters characterize the memory solution. Among them are latency (how long the CPU needs to wait before the first data is available) and bandwidth (how fast additional data can be “streamed” after the first data poi... » read more

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