The Week In Review: Manufacturing


Chipmakers As reported, Samsung is expanding its efforts in the foundry business, a move that will put the company on a collision course with TSMC and others. Samsung's foundry unit is expanding is logic portfolio and moving into the specialty foundry front. It will also make its advanced packaging technology available, such as 2.5D interposers, to customers. In a blog, Samsung said it plans t... » read more

The Week In Review: Manufacturing


Chipmakers TSMC remained the world’s largest foundry vendor with a 54.3% share in 2015, according to the rankings from Gartner. GlobalFoundries moved into the No. 2 position with 9.6% of the market. The No. 3 position went to UMC with $4.5 billion in revenue, representing 9.3% of the market, according to the firm, which said Samsung remains No. 4. SMIC, which is No. 5, is gaining ground. ... » read more

The Week In Review: Manufacturing


Fab tool vendors In terms of sales for 2015, Applied Materials retained the No. 1 position in the wafer fab equipment (WFE) market with 1.3% growth last year, according to Garnter. Lam Research experienced the strongest growth of the top 10 vendors in 2015, moving into the No. 2 position. In the rankings, Lam jumped ahead of ASML and TEL. ASML was in third place, followed in order by TEL, KLA-... » read more

The Week In Review: Manufacturing


Chipmakers Lawrence Livermore National Laboratory (LLNL) has purchased a brain-inspired supercomputing platform for deep learning developed by IBM Research. LLNL will receive a 16-chip TrueNorth system from IBM. A single TrueNorth processor from IBM consists of 5.4 billion transistors wired together to create an array of 1 million digital neurons. The chip is fabricated based on a 28nm LPP pro... » read more

New Memory Approaches And Issues


New memory types and approaches are being developed and tested as DRAM and Moore's Law both run out of steam, adding greatly to the confusion of what comes next and how that will affect chip designs. What fits where in the memory hierarchy is becoming less clear as the semiconductor industry grapples with these changes. New architectures, such as [getkc id="202" kc_name="fan-outs"] and [getk... » read more

Manufacturing Bits: March 1


Gravitational-wave observatories India has approved the construction of the world’s third gravitational-wave observatory. This facility will replicate the two Laser Interferometer Gravitational-wave Observatories (LIGOs) in the United States, which recently detected the world's first gravitational waves. The Indian project, dubbed LIGO-India, is expected to go online in 2023. The effort b... » read more

What’s Next For DRAM?


The DRAM business has always been challenging. Over the years, DRAM suppliers have experienced a number of boom and bust cycles in a competitive landscape. But now, the industry faces a cloudy, if not an uncertain, future. On one front, for example, [getkc id="93" kc_name="DRAM"] vendors face a downturn amid a capacity glut and falling product prices in 2016. But despite the business chal... » read more

1xnm DRAM Challenges


At a recent event, Samsung presented a paper that described how the company plans to extend today’s planar DRAMs down to 20nm and beyond. This is an amazing feat. Until very recently, most engineers believed DRAMs would stop scaling at 20nm or so. Instead, Samsung is ramping up the world’s most advanced DRAMs—a line of 20nm parts—with plans to go even further. Micron and SK Hynix soo... » read more

Memory Lane: Far From A Leisurely Stroll


The only semiconductor market segment that has not been taken over by the foundries and still remains dominated by IDMs is the memory sector. The memory market is the last bastion for true IDM manufacturers, who must be savvy in the changing trends in end market applications, advanced technology development, and must still determine how much and when to invest in additional capacity. With on... » read more

An Insider’s Guide To Planar And 3D DRAM


Semiconductor Engineering sat down to talk about planar DRAMs, 3D DRAMs, scaling and systems design with Charles Slayman, technical leader of engineering at network equipment giant Cisco Systems. What follows are excerpts of that conversation. SE: What types of DRAM do network equipment OEMs look at or buy these days? Slayman: When we look at DRAM, we look at it for networking applicatio... » read more

← Older posts Newer posts →