Yield Impact For Wafer Shape Misregistration-Based Binning For Overlay APC Diagnostic Enhancement


By David Jayez, Kevin Jock, Yue Zhou and Venugopal Govindarajulu of GlobalFoundries, and Zhen Zhang, Fatima Anis, Felipe Tijiwa-Birk and Shivam Agarwal of KLA. 1. ABSTRACT The importance of traditionally acceptable sources of variation has started to become more critical as semiconductor technologies continue to push into smaller technology nodes. New metrology techniques are needed to pur... » read more