Lithography Challenges For Fan-out

Higher density fan-out packages are moving toward more complex structures with finer routing layers, all of which requires more capable lithography equipment and other tools. The latest high-density fan-out packages are migrating toward the 1µm line/space barrier and beyond, which is considered a milestone in the industry. At these critical dimensions (CDs), fan-outs will provide better per... » read more

New Rules For DRAM

By Jim Feldhan DRAM revenues grew by more than 30% in 2013. Average selling prices increased more than 45% as capacity constraints especially for LPDRAM, motivated the transition from 2GB density parts up to 4GB DRAM units declined by almost 10%. Revenue growth rates of more than 30% combined with a declining unit base are not new to the memory market. But 2013 was a pivotal year for DRAM. ... » read more