Context Is Everything

By Ann Mutschler - 29 Aug, 2016 - Comments: 0

With consumer and industrial IoT applications, the importance of system context to IC vendors is paramount. No more are the days of developing a chip in isolation; close partnership with systems companies is de rigueur as they provide the use case data that is foundational to development of systems that work. While this makes sense in a smartphone, it’s significantly harder to achieve in a... » read more

Reaching The Power Budget

By Ann Mutschler - 11 Aug, 2016 - Comments: 1

Everything related to power in chip design today is a big deal—and it’s just getting bigger. Meeting the power budget is becoming harder at each new node, but it's also becoming difficult in a number of new application areas at existing nodes. That's a big problem because [getkc id="108" kc_name="power"] is now considered a competitive advantage in many markets. It's also one of the most... » read more

Pattern Dependence Process Modeling

By Joseph Ervin - 21 Jul, 2016 - Comments: 0

First order process modeling can help tremendously with process setup and integration challenges that occur in a semiconductor fabrication flow, by visualizing process variation problems “virtually” prior to actual fabrication. In some instances, a deeper level of complexity needs to be added to the process model to capture the effects of variation in the process. Specific examples inclu... » read more

System-Level Verification Tackles New Role

By Brian Bailey - 09 Jun, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss advances in system-level verification with Larry Melling, product management director for the system verification group of [getentity id="22032" e_name="Cadence"]; Larry Lapides, VP of sales for [getentity id="22036" e_name="Imperas”] and Jean-Marie Brunet, director of marketing for the emulation division of [getentity id="22017" e_name="Mentor Gr... » read more

The Week In Review: IoT

By Jeff Dorsch - 03 Jun, 2016 - Comments: 0

Taiwan’s annual Computex trade show, celebrating its 35th anniversary this year, opened this week, and the Internet of Things is among the focus areas of the exhibition. Tsai Ing-wen, the new president of Taiwan, said at the opening ceremony, “The IoT era is coming strong. Taiwan must focus on the integration of hardware and software along with low-volume, high-variety manufacturing capabil... » read more

Cooperation Instead Of Competition

By Bill Neifert - 03 Jun, 2016 - Comments: 0

I spent more than 20 years working in EDA and managed to do so without ever working for one of the big three. Big EDA companies were always the competition. Oh sure, you’d partner with them strategically if you could, but always keeping in mind that little fish swimming with big fish often end up being eaten. That all changed seven months ago when ARM acquired Carbon’s technology and tea... » read more

Foundation IP For 7nm FinFETs: Design And Implementation

By Synopsys - 13 Apr, 2016 - Comments: 0

Learn about the challenges of IP design and implementation for 7nm FinFETs. Along with the performance and area benefits that the node brings, designers must understand the significant technical challenges stemming from increasing variability associated with tighter pitches and more complex lithography steps. Design for variability and reliability considerations will require comprehensive model... » read more

New Memory Approaches And Issues

By Ed Sperling - 14 Mar, 2016 - Comments: 1

New memory types and approaches are being developed and tested as DRAM and Moore's Law both run out of steam, adding greatly to the confusion of what comes next and how that will affect chip designs. What fits where in the memory hierarchy is becoming less clear as the semiconductor industry grapples with these changes. New architectures, such as [getkc id="202" kc_name="fan-outs"] and [getk... » read more

Mixed-Signal Design Powers Ahead

By Ann Mutschler - 10 Mar, 2016 - Comments: 1

Mixed-signal devices are at the heart of many advanced systems today because of the need to interact with the outside world, but designing and verifying these systems is getting harder. There are several reasons for this. First, almost all of these devices now have to be lower power than in the past, and in the analog space it's not as simple as just dialing down part of a block. Second, it ... » read more

Complete Systems Modeling And Simulation For Complex Product Development

By Ansys - 24 Feb, 2016 - Comments: 0

As products in the marketplace incorporate more and more complexity, the product design process must keep pace to ensure safe, efficient and reliable integration of complicated systems, subsystems and components. Few products today involve a mere single physics; most encompass multidisciplinary behaviors and interactions (with subsequent, sometimes unpredictable, cause and effect). Though simul... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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