So Many Waivers Hiding Issues


Semiconductor Engineering sat down to discuss problems associated with domain crossings with Alex Gnusin, design verification technologist for Aldec; Pete Hardee, director, product management for Cadence; Joe Hupcey, product manager and verification product technologist for Mentor, a Siemens Business; Sven Beyer, product manager design verification for OneSpin; and Godwin Maben, applications en... » read more

Autonomy, Electrification And The Rise Of Model-Based EE Design


Powerful software that automatically transforms input models into deterministic outputs is transforming automotive electrical and electronics (EE) design. Martin O'Brien and Dan Scott set the stage for Mentor's advanced generative engineering approach. To read more, click here. » read more

Comprehensive CDC Verification Using Advanced Hierarchical Data Models


In this paper, we describe the hierarchical data model (HDM), which is a performance efficient alternative to the traditional flat CDC verification flow. The HDM is equivalent to an abstract CDC model of the IP that captures the CDC intent of the block along with its integration rules. It is a generic data model that can be seamlessly re-used across releases and across designs wherever the IP i... » read more

The Veloce Strato Platform: Unique Core Components Create High-Value Advantages


The Veloce Strato Emulation platform has sufficient execution speed, full visibility capabilities and ease-of-use in model creation and model updates to span the entire range of needs throughout the life of the design development process. To read more, click here. » read more

The Trouble With Models


Models are becoming more difficult to develop, integrate and utilize effectively at 10/7nm and beyond as design complexity, process variation and physical effects add to the number of variables that need to be taken into account. Modeling is a way of abstracting the complexity in various parts of the semiconductor design, and there can be dozens of models required for complex SoCs. Some are ... » read more

Making Software Development Equivalent For Models And Boards


Selected Cortex-M processors include the instruction trace microcell (ITM) to help understand system behavior. Although it can provide other types of trace, the ITM is commonly associated with printf() output and event tracing from applications and operating systems. Historically, Fast Model systems have used semihosting or UART models to provide character and file I/O when running software on ... » read more

Fast Models, Cycle Models


There has been a lot of coverage since the launch of new CPU and graphics cores at Computex 2017, including some information about early software development. The public announcement of new ARM IP is a milestone for ARM Models because it means we can now talk about available models and share additional information about the new IP. ARM Fast Models and Cycle Models enable virtual prototyping ... » read more

Verification Unification


Semiconductor Engineering brought together industry luminaries to initiate the discussion about the role that formal technologies will play with Portable Stimulus and how it may help to bring the two execution technologies closer together. Participating in this roundtable are Joe Hupcey, verification product technologist for [getentity id="22017" e_name="Mentor, a Siemens Business"]; Tom Fitzpa... » read more

Power/Performance Bits: June 13


Theoretical all-carbon circuits Engineers at the University of Texas at Dallas, the University of Illinois at Urbana-Champaign, the University of Central Florida, and Northwestern University designed a novel computing system made solely from carbon. "The concept brings together an assortment of existing nanoscale technologies and combines them in a new way," said Dr. Joseph S. Friedman, ass... » read more

Huawei Delivers Outstandingly Accurate Models


By John Parry, Mentor, a Siemens Business, and Yake Fang, Huawei Technologies Co., Ltd. Packaging high-performance multi-core IC devices used in communication applications is a key challenge for both manufacturers and system integrators. Traditionally a System-in-Package (SiP) has been taken, with chips mounted side-by-side, allowing differing semiconductor technologies to be mixed. More r... » read more

← Older posts