tag: Movellus

Chip Industry Week In Review
By The SE Staff - 27 Oct, 2023 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan The Biden-Harris administration designated 31 Tech Hubs across the U.S. this week, focused on industries including autonomous systems, quantum computing, biotechnology, precision medicine, clean energy advancement, and semiconductor manufacturing. The Department of Commerce (DOC) also launched its second Tech Hubs Notice of Funding Opportunity. ... » read more

Leaps in Quantum Computing
By Barry Pangrle - 26 Oct, 2023 - Comments: 0

There are new computers that are generating some amazing results for solving problems in record time.  You won’t see these computers on the classic Top500 lists though, because they aren’t approaching computing in the same way. Using quantum computing algorithms like Shor’s algorithm for factoring large numbers, quantum computing holds the promise of solving problems that take exponentia... » read more

Why Using Commercial Chiplets Is So Difficult
By Ed Sperling - 18 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

Everyone’s A System Designer With Heterogeneous Integration
By Ann Mutschler - 02 Oct, 2023 - Comments: 0

The move away from monolithic SoCs to heterogeneous chips and chiplets in a package is accelerating, setting in motion a broad shift in methodologies, collaborations, and design goals that are felt by engineers at every step of the flow, from design through manufacturing. Nearly every engineer is now working or touching some technology, process, or methodology that is new. And they are inter... » read more

IBM’s Energy-Efficient NorthPole AI Unit
By Barry Pangrle - 28 Sep, 2023 - Comments: 0

At this point it is well known that from an energy efficiency standpoint, the biggest bang for the back is to be found at the highest levels of abstraction. Fitting the right architecture to the task at hand i.e., an application specific architecture, will lead to benefits that are hard or impossible to claw back later in the design and implementation flow.  With the huge increase in the inter... » read more

Why Chiplets Don’t Work For All Designs
By Ed Sperling - 20 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss use cases and challenges for commercial chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts... » read more

Managing P/P Tradeoffs With Voltage Droop Gets Trickier
By Ann Mutschler - 14 Sep, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about voltage droop/IR drop with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight Technologies; Venkatesh Santhanagopalan, product manager at Movellus; Joe Davis, senior director for Calibre interfaces and mPower EM/IR... » read more

Performance & Efficiency Cores For Servers
By Barry Pangrle - 31 Aug, 2023 - Comments: 0

HotChips 2023 was held August 27-29, 2023 at Stanford University in California and was the first in-person version of the conference in 4 years. The conference was held in a hybrid format that had over 500 participants in-person and over 1,000 attending virtually online. Topics covered a broad range of advancements in computing, connectivity, and computer architecture. Both AMD and Intel gav... » read more

Balancing IR Drop Unpredictability With Post-Silicon Flexibility
By Aakash Jani - 24 Aug, 2023 - Comments: 0

The concept of IR drop in silicon chips has always been a crucial aspect of chip design. However, recent technological trends and the emergence of new challenges, such as voltage-sensitive paths, have introduced a degree of uncertainty in predicting and effectively managing IR drop. These uncertainties are driving the need for a more flexible approach in mitigating on-die voltage droop. Increa... » read more

Preparing For Commercial Chiplets
By Ed Sperling - 24 Aug, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the path to commercialization of chiplets with Saif Alam, vice president of engineering at Movellus; Tony Mastroianni, advanced packaging solutions director at Siemens Digital Industries Software; Mark Kuemerle, vice president of technology at Marvell; and Craig Bishop, CTO at Deca Technologies. What follows are excerpts of tha... » read more

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