A report titled “Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP)” was published by researchers at SEMI and the University of California Los Angeles (UCLA)'s Center for Heterogeneous Integration and Performance Scaling (CHIPS), and funded by the National Institute of Standards and Technology (NIST).
MRHIEP Goals:
"The goal of MRHIEP is to develop an o...
» read more
