Heterogeneous Integration And Electronics Packaging Manufacturing Roadmap (SEMI & UCLA)


A report titled “Manufacturing Roadmap for Heterogeneous Integration and Electronics Packaging (MRHIEP)” was published by researchers at SEMI and the University of California Los Angeles (UCLA)’s Center for Heterogeneous Integration and Performance Scaling (CHIPS), and funded by the National Institute of Standards and Technology (NIST).


“The goal of MRHIEP is to develop an operational road map for jump starting advanced packaging in the US, with the creation of a quick-start guide for on-shore rapid development, piloting, prototyping and manufacturing. This manufacturing roadmap is inspired by the Heterogeneous Integration Roadmap (HIR). MRHIEP focuses on leveraging on-shore skills, capabilities, and infrastructure, towards building on-shore resiliency with a diverse, robust, and secure global supply chain. MRHIEP is focused on defining a manufacturing-centric packaging roadmap for two major segments, (1) High performance computing (HPC) and (2) Medical electronics & hybrid device packaging. It is believed that these two sectors can provide a foundational developmental roadmap for other applications sectors such as rf/mm wave, automobile, and power electronics as well.”

Find the report here. Published February 2024. Read this related news article from SEMI.

This roadmap addresses advanced packaging and was lead by UCLA CHIPS and SEMI (USA) and was sponsored by NIST under award 70NANB22H038, and is submitted as final report.

Related Reading
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