Week In Review: Manufacturing, Test

By Mark LaPedus - 12 Oct, 2018 - Comments: 0

Chipmakers GlobalFoundries has announced the addition of nine new partners to its RFwave Partner Program, including AkronIC, Ask Radio, Catena, University of Waterloo Centre for Intelligent Antenna and Radio Systems (CIARS), Giga Solution, Helic, Incize, Mentor Graphics and Xpeedic Technology. The RFwave Partner Program builds upon GF’s radio-frequency (RF) efforts. The new partners will pro... » read more

The Week In Review: Aug 5

By Ed Sperling - 05 Aug, 2013 - Comments: 0

By Mark LaPedus According to a nationwide online survey conducted by Harris Interactive on behalf of Crucial.com, 36% of those Americans who experienced PC problems in the past six months admit they have lashed out at their slow, underperforming computers by using profanity, screaming and shouting, or by striking it with a fist or other object. Those who experienced computer problems also indi... » read more

Supersizing Wafers

By Ed Sperling - 24 Jan, 2013 - Comments: 0

By Katherine Derbyshire Get ready for 450mm wafers. First seriously considered in 2005, these supersized wafers, along with the equipment to handle, measure, and process them, have gradually made their way to the top of the semiconductor industry’s priority list. But what exactly does that mean? What will 450mm fabs look like, and how will they differ from the 300-mm fabs being built toda... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: M+W Group

Week In Review: Manufacturing, Test

The Week In Review: Aug 5

Supersizing Wafers