tag: NAND

NAND Flash Targets 1,000 Layers
By Bryon Moyer - 04 Dec, 2024 - Comments: 0

The chip industry is pushing to quadruple the stack height of 3D NAND flash from 200 layers to 800 layers or more over the next few years, using the additional capacity will help to feed the unending need for more memory of all types. Those additional layers will add new reliability issues a number of incremental reliability challenges, but the NAND flash industry has been steadily increasin... » read more

Week In Review: Manufacturing, Test
By Gregory Haley - 01 Sep, 2023 - Comments: 0

Bosch completed its acquisition of TSI Semiconductors to expand its SiC chips business, reports Reuters. In April, Bosch announced plans to invest $1.5 billion in the Roseville, California, foundry to convert TSI’s manufacturing facilities into state-of-the-art processes, with the first SiC chips due out in 2026. Bosch CEO Stefan Hartung said the full expansion "depends on the support of the... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 11 Aug, 2023 - Comments: 0

TSMC, Bosch, Infineon, and NXP will jointly invest in the European Semiconductor Manufacturing Co. (ESMC), in Dresden, Germany, to provide advanced semiconductor manufacturing services. ESMC marks a significant step toward construction of a 300mm fab, which is expected to have a monthly production capacity of 40,000 300mm (12-inch) wafers on TSMC’s 28/22nm planar CMOS and 16/12nm finFET proce... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 07 Jul, 2023 - Comments: 0

China retaliated against a U.S. embargo on advanced semiconductor equipment exports by restricting exports of gallium and germanium. Both metals are widely used in semiconductors and electric vehicles. Despite export controls for advanced chips and equipment imposed on Chinese foundries by the U.S. and its allies, TrendForce predicts China's 300mm market share likely will increase from 24% ... » read more

Exploring The World Of Flash Memory: Serial, Dual, Quad, And Octal Interface
By Dharini Subashchandran - 08 Jun, 2023 - Comments: 0

By Dharini SubashChandran and Manoj Kachadiya In the world of digital data storage, flash memory has become an indispensable technology. Flash memory devices are non-volatile storage solutions that can retain data even without power. They are widely used in various applications, including smartphones, digital cameras, USB drives, and solid-state drives (SSDs). In this blog post, we will delv... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 02 Jun, 2023 - Comments: 0

Japanese and American trade officials announced a joint roadmap for cooperation in strengthening global semiconductor supply chains by advancing Japan-U.S. collaboration with emerging and developing countries in the Indo-Pacific. China and South Korea agreed to strengthen dialogue and cooperation on semiconductor industry supply chains with a focus on the supply of key raw materials and ensu... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 12 May, 2023 - Comments: 0

Global semiconductor sales reached $574 billion in 2022, and U.S. semiconductor companies accounted for sales totaling $275 billion, or 48% of the global market, according to the 2023 Factbook released by the Semiconductor Industry Association (SIA). DRAM and NAND prices likely will continue to fall further this quarter because production cuts have not kept pace with weakening demand, accord... » read more

3D Structures Challenge Wire Bond Inspection
By Karen Heyman - 09 May, 2023 - Comments: 1

Adding more layers in packages is making it difficult, and sometimes impossible, to inspect wire bonds that are deep within the different layers. Wire bonds may seem like old technology, but it remains the bonding approach of choice for a broad swath of applications. This is particularly evident in automotive, industrial, and many consumer applications, where the majority of chips are not de... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 31 Mar, 2023 - Comments: 0

The U.S. Commerce Department outlined proposed rules for the Chips for America Incentives Program, including additional details on national security measures applicable to the CHIPS Incentives Program included in the CHIPS and Science Act. The rules limit funding recipients from investing in the expansion of semiconductor manufacturing in foreign countries of concern, notably the People’s Rep... » read more

Metrology Strategies For 2nm Processes
By Laura Peters - 07 Mar, 2023 - Comments: 3

Metrology and wafer inspection processes are changing to keep up with evolving and new device applications. While fab floors still have plenty of OCD tools, ellipsometers, and CD-SEMs, new systems are taking on the increasingly 3D nature of structures and the new materials they incorporate. For instance, processes like hybrid bonding, 3D NAND flash devices, and nanosheet FETs are pushing the bo... » read more

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