Hacking DNA To Make 3D Nanostructures

A technical paper titled “Three-dimensional nanoscale metal, metal oxide, and semiconductor frameworks through DNA-programmable assembly and templating” was published by researchers at Brookhaven National Laboratory, Columbia University, and Stony Brook University. Abstract: "Controlling the three-dimensional (3D) nanoarchitecture of inorganic materials is imperative for enabling their no... » read more

Manufacturing Bits: Feb. 18

Molecular layer etch The U.S. Department of Energy’s Argonne National Laboratory has made new advances in the field of molecular layer etching or etch (MLE). MLE is related to atomic layer etch (ALE). Used in the semiconductor industry, ALE selectively removes targeted materials at the atomic scale without damaging other parts of the structure. ALE is related to atomic layer deposition... » read more