Chip Industry Week in Review

By The SE Staff - 02 Aug, 2024 - Comments: 0

Okinawa Institute of Science and Technology proposed a new EUV litho technology using only four reflective mirrors and a new method of illumination optics that it claims will use 1/10 the power and cost half as much as existing EUV technology from ASML. Applied Materials may not receive expected U.S. funding to build a $4 billion research facility in Sunnyvale, CA, due to internal government... » read more

Technical Paper Roundup: Sept. 12

By Linda Christensen - 12 Sep, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=51 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit f... » read more

Control of the Schottky barrier height in monolayer WS2 FETs using molecular doping (NIST)

By Technical Paper Link - 07 Sep, 2022 - Comments: 0

A new research paper titled "Control of the Schottky barrier height in monolayer WS2 FETs using molecular doping" was published by researchers at NIST, Theiss Research, Naval Research Laboratory, and Nova Research. Abstract: "The development of processes to controllably dope two-dimensional semiconductors is critical to achieving next generation electronic and optoelectronic devices. Unde... » read more

System Bits: June 18

By Jeff Dorsch - 18 Jun, 2019 - Comments: 0

Another win for aUToronto Photo credit: University of Toronto The University of Toronto’s student-led self-driving car team racked up its second consecutive victory last month at the annual AutoDrive Challenge in Ann Arbor, Mich. The three-year challenge goes out to North American universities, offering a Chevrolet Bolt electric vehicle to outfit with autonomous driving technology.... » read more

Power/Performance Bits: May 9

By Jesse Allen - 09 May, 2017 - Comments: 0

Integrated battery and solar cell Researchers from the Ulsan National Institute of Science and Technology (UNIST) in Korea developed a single-unit, photo-rechargeable portable power source based on miniaturized crystalline Si photovoltaics (c-Si PVs) and printed solid-state lithium-ion batteries (LIBs). The device uses a thin-film printing technique, in which the solid-state LIB is directly ... » read more

Manufacturing Bits: Jan. 31

By Mark LaPedus - 31 Jan, 2017 - Comments: 0

Fiber-imprint patterning The École polytechnique fédérale de Lausanne (EPFL)--a research institute/university in Lausanne, Switzerland--has put a new twist in nano-imprint patterning technology. It has devised a way to imprint tiny or nano-metric patterns on hollow polymer fiber. Using a technique called thermal drawing, tiny patterns can be printed on both the inside and the outside of ... » read more

Manufacturing Bits: Feb. 4

By Mark LaPedus - 04 Feb, 2014 - Comments: 0

Secrets of mass variation The General Conference on Weights and Measures will soon approve a plan to redefine the kilogram and other measurement units. The new definition for the kilogram will be based on the fixed numerical values of Planck’s constant (h). Supposedly, the new definition will solve the current problem. The kilogram is the only SI unit that is still described as an artif... » read more

Knowledge Centers
Entities, people and technologies explored

Intel Vs. Samsung Vs. TSMC

Foundry competition heats up in three dimensions and with novel technologies as planar scaling benefits diminish.

by Ed Sperling

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters