Nanofabrication Protocol That Allows Patterning Metallic Electrodes on 2D Materials Reliably (KAUST, National University of Singapore)


A new technical paper titled "High-yield photolithography protocol to pattern metallic electrodes on 2D materials without adhesive metallic layers" was published by researchers at KAUST and National University of Singapore. Abstract "When using two-dimensional (2D) materials to build electronic devices, adjacent metallic films need to be deposited to form electrodes. However, weak adhesion ... » read more

Process To Produce High Aspect Ratio Electroplated Copper Pillars On 300 mm Wafers


This work provides details of a complete and partially optimized process to manufacture high aspect ratio copper pillars with heights of up to 80 µm on 200 and 300 mm wafers. Across wafer uniformity data for all materials and process steps are given. Results will show excellent resist adhesion on copper and electroplating durability. Cross sectional SEM analysis of resist and electroplated pil... » read more