tag: NI

Signals In The Noise: Tackling High-Frequency IC Test
By Gregory Haley - 15 Oct, 2024 - Comments: 0

The need for high-frequency semiconductor devices is surging, fueled by growing demand for advanced telecommunications, faster sensors, and increasingly autonomous vehicles. The advent of millimeter-wave communication in 5G and 6G is pushing manufacturers to develop chips capable of handling frequencies that were once considered out of reach. However, while these technologies promise faster ... » read more

Promises and Perils of Parallel Test
By Anne Meixner - 10 Sep, 2024 - Comments: 1

Testing multiple devices at the same time is not providing the equivalent reduction in overall test time due to a combination of test execution issues, the complexity of the devices being tested, and the complex tradeoffs required for parallelism. Parallel testing is now the norm — from full wafer probe DRAM testing with thousands of dies to two-site testing for complex, high-performance c... » read more

Chip Industry Week In Review
By The SE Staff - 23 Aug, 2024 - Comments: 0

Chinese firms imported almost $26 billion worth of chipmaking machinery, according to fresh trade data released by China’s General Administration of Customs this week, Bloomberg reports. Meanwhile, the global semiconductor manufacturing industry continued to show signs of improvement in Q2 2024 with significant growth of IC sales, stabilizing capital expenditure, and an increase in install... » read more

Bluetooth’s New Era: The Role Of Channel Sounding And Adaptable Testing Solutions
By Jake Harnack - 07 Aug, 2024 - Comments: 0

By Jake Harnack and Alejandro Escobar Calderon Bluetooth technology has experienced a remarkable transformation since its inception, evolving from a basic tool for data transfer to a near-ubiquitous wireless technology used for audio streaming, location services, and smart-home networks. As sales of Bluetooth-enabled devices nears 5 billion units per year in 2024, the Bluetooth standard is e... » read more

AI/ML’s Role In Design And Test Expands
By Laura Peters - 06 Aug, 2024 - Comments: 1

The role of AI and ML in test keeps growing, providing significant time and money savings that often exceed initial expectations. But it doesn't work in all cases, sometimes even disrupting well-tested process flows with questionable return on investment. One of the big attractions of AI is its ability to apply analytics to large data sets that are otherwise limited by human capabilities. In... » read more

Metrology And Inspection For The Chiplet Era
By Gregory Haley - 06 Aug, 2024 - Comments: 0

New developments and innovations in metrology and inspection will enable chipmakers to identify and address defects faster and with greater accuracy than ever before, all of which will be required at future process nodes and in densely packed assemblies of chiplets. These advances will affect both front-end and back-end processes, providing increased precision and efficiency, combined with a... » read more

Driving Cost Lower and Power Higher With GaN
By Anne Meixner - 06 Aug, 2024 - Comments: 0

Gallium nitride is starting to make broader inroads in the lower-end of the high-voltage, wide-bandgap power FET market, where silicon carbide has been the technology of choice. This shift is driven by lower costs and processes that are more compatible with bulk silicon. Efficiency, power density (size), and cost are the three major concerns in power electronics, and GaN can meet all three c... » read more

Controller Area Network (CAN) Overview
By NI - 06 Aug, 2024 - Comments: 0

What is CAN? A controller area network (CAN) bus is a high-integrity serial bus system for networking intelligent devices. CAN busses and devices are common components in automotive and industrial systems. Using a CAN interface device, you can write LabVIEW applications to communicate with a CAN network. CAN History Bosch originally developed CAN in 1985 for in-vehicle networks.... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

The Semiconductor Revolution And The Role Of Adaptable Testing
By Juan Valdivia - 09 Jul, 2024 - Comments: 0

The semiconductor industry, the backbone of modern technology, is experiencing a rapid evolution driven by the increasing demands for higher performance, greater functionality, and lower power consumption. This evolution is creating new challenges and opportunities in the testing of mixed signal and RF semiconductors and electronics devices, making the need for adaptable and flexible test syste... » read more

← Older posts

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy