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Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — IoT, edge, cloud, data center, and back Foxconn (also known as Hon Hai Technology Group) is forming a joint venture (JV) with Yageo Group, a component production and process management company for EVs and other high-end electronics, to focus on the development of semiconductors under $2 USD, which they call “small ICs.” Through the JV, a new company called XSemi wil... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Infineon announced it has a Trusted Platform Module (TPM 2.0), called OPTIGA TPM 2.0, used to secure remote software updates, disc encryption, and user authentication on Linux-based systems. OPTIGA is an open software stack for securing comprehensive TSS* host software implementing the latest FAPI standard. Infineon developed the open-source software with Intel Corporation and Fraunho... » read more

Part Average Tests For Auto ICs Not Good Enough


Part Average Testing (PAT) has long been used in automotive. For some semiconductor technologies it remains viable, while for others it is no longer good enough. Automakers are bracing for chips developed at advanced process nodes with much trepidation. Tight control of their supply chains and a reliance upon mature electronic processes so far have enabled them to increase electronic compone... » read more

Data Issues Mount In Chip Manufacturing


For yield management systems the old calculation adage, "garbage in/garbage out" still rings true. Aligning and cleaning data remains a dirty business. With the increased value in data in the semiconductor supply chain, there now are essentially two supply chains running in parallel. One involves the physical product being created, while the other includes the data associated with each proce... » read more

Week In Review: Manufacturing, Test


Chipmakers SMIC’s shares fell following the resignation of the company co-CEO, according to a report from Bloomberg. Liang Mong Song, co-CEO of the Chinese foundry company, has proposed to resign and the company has become aware of Liang’s intention of conditional resignation, according to a filing. A former technologist at TSMC and Samsung, Liang has opposed the appointment of a new board... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Austin, Texas-based automotive startup Uhnder raised $45 million in Series C funding for its digital radar-on-chip. Telechips, a fabless semiconductor company that works on automotive SoCs, is using Arm’s IP to design its Dolphin5 SoC for ADAS (advanced drive assistance systems) and digital cockpits with in-vehicle infotainment (IVI). Dolphin5 will include the Arm’s Mali-G78A... » read more

Infrastructure Impacts Data Analytics


Semiconductor data analytics relies upon timely, error-free data from the manufacturing processes, but the IT infrastructure investment and engineering effort needed to deliver that data is, expensive, enormous, and still growing. The volume of data has ballooned at all points of data generation as equipment makers add more sensors into their tools, and as monitors are embedded into the chip... » read more

Week In Review: Manufacturing, Test


Fab tools PDF Solutions has entered into a definitive agreement to acquire Cimetrix. Under the terms, PDF will pay a cash amount of $35.0 million, net of cash on Cimetrix’s balance sheet as of closing, and subject to other closing adjustments. With the move, PDF will expand into new markets. Cimetrix is a provider of equipment connectivity products for smart manufacturing and Industry 4.0... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Apple has introduced a new MacBook Air, 13-inch MacBook Pro, and Mac mini powered by the M1, the first in a family of chips designed by Apple specifically for the Mac. Based on a 5nm process from TSMC, the M1 is packed with 16 billion transistors, the most Apple has ever put into a chip. It features a CPU core, graphics, AI and other functions all in the same chip. In total... » read more

Week In Review: Manufacturing, Test


Trade and government The U.S. continues to tighten its export controls for hi-tech, including a move to restrict fab technologies that enable 5nm chip production. The U.S. Department of Commerce has imposed controls on six more technologies, bringing the total to 37. They include: hybrid additive manufacturing/computer controlled tools; computational lithography software designed for EUV masks... » read more

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