Week In Review: Auto, Security, Pervasive Computing

By Linda Christensen - 26 May, 2023 - Comments: 0

The U.S. Cybersecurity and Infrastructure Security Agency (CISA) issued a cybersecurity warning about Chinese state-sponsored activity impacting networks across U.S. critical infrastructure. “One of the actor’s primary tactics, techniques, and procedures (TTPs) is living off the land, which uses built-in network administration tools to perform their objectives," the agency said. Hacking eff... » read more

Week In Review: Design, Low Power

By Karen Heyman - 26 May, 2023 - Comments: 0

Cadence bought Pulsic, a U.K.-based developer of place-and-route tools for custom digital and analog. The acquisition follows a previous acquisition attempt by a Chinese firm in August 2022, which was blocked by the U.K. government. At the G7 Summit in Japan, IBM announced a 10-year, $100 million initiative with the University of Tokyo and the University of Chicago to develop a quantum-centr... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 12 May, 2023 - Comments: 0

Global semiconductor sales reached $574 billion in 2022, and U.S. semiconductor companies accounted for sales totaling $275 billion, or 48% of the global market, according to the 2023 Factbook released by the Semiconductor Industry Association (SIA). DRAM and NAND prices likely will continue to fall further this quarter because production cuts have not kept pace with weakening demand, accord... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 12 May, 2023 - Comments: 0

Automotive, mobility Qualcomm signed a definitive agreement to acquire fabless semiconductor company Autotalks, maker of automotive-qualified vehicle-to-everything (V2X) SoCs, processors, sensors, V2X RF transceivers, and other products for use in automatic braking and cooperative perception systems (where a vehicle can see what another vehicle is seeing). Autotalks’ V2X products are dual-m... » read more

What’s Next In Wireless Standard Adoption?

By Chen Chang - 27 Apr, 2023 - Comments: 0

By Chen Chang and Alejandro Escobar Calderon Although each generation in wireless technologies often introduces enhanced capabilities, the broad adoption of any new technology requires both technical and business viability. For 5G, solving for technical challenges such as path loss and radio front-end efficiency has led to massive innovations in network design, semiconductor packaging, and t... » read more

AI Becoming More Prominent In Chip Design

By Ed Sperling - 27 Mar, 2023 - Comments: 0

Semiconductor Engineering sat down to talk about the role of AI in managing data and improving designs, and its growing role in pathfinding and preventing silent data corruption, with Michael Jackson, corporate vice president for R&D at Cadence; Joel Sumner, vice president of semiconductor and electronics engineering at National Instruments; Grace Yu, product and engineering manager at Meta... » read more

Rethinking Validation To Improve Products Quicker

By Kaitlynn Mazzarella - 23 Mar, 2023 - Comments: 0

By Kaitlynn Mazzarella and Marvin Landrum The boundaries of measurement science are being pushed more than ever before. Keeping up with evolving industry needs is not a simple feat. Not only does each new technology create business opportunities for companies to take share in new markets, but it also changes the way we design and test products. As the pace of technical innovation accelerates... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 22 Jul, 2022 - Comments: 0

Security Flex Logix Technologies is partnering with Intrinsic ID to secure and protect any device using its eFPGA, so the device can’t be modified maliciously, through physical attacks or remote hacking. Flex Logix’s EFLX ePFGA will have Intrinsic ID’s SRAM physical unclonable function (PUF), a military-grade security IP that gives a device a unique silicon ID. The ID secures confidentia... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 27 May, 2022 - Comments: 0

Automotive, mobility Cadence is now an official technology partner of the McLaren Formula 1 Team. The team will use Cadence’s Fidelity CFD Software to look at the computational fluid dynamics (CFD) of the airflow around the race cars and predict how a car design will affect the airflow. Infineon uncorked its XENSIV 60 GHz automotive radar sensor for in-cabin monitoring systems. One use ca... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 05 Nov, 2021 - Comments: 0

Automotive The U.S. Department of Energy (DOE) is funding 25 cleaner car and truck projects with $199 million. Projects include long-haul trucks powered by batteries and fuel cells, and at improving the nation’s electric vehicle (EV) charging infrastructure. The Volvo Group North America (VGNA) will receive $18 million in federal funds under DOE’s SuperTruck 3 Program. Daimler Trucks N... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NI

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Design, Low Power

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Auto, Security, Pervasive Computing

What’s Next In Wireless Standard Adoption?

AI Becoming More Prominent In Chip Design

Rethinking Validation To Improve Products Quicker

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing